By Cameron Chai
Zeta Cap, an innovative glass-free laminate produced by Integral Technologies, has been awarded a US patent. The patent was applied for Zeta Cap as an enhanced rigid printed circuit board insulating layer.
Integral Technologies manufactures and supplies HDI electronic materials for the printed circuit board market. The company’s Zeta Cap lamination in conjunction with other related laminates are set to revolutionize the printed circuit board industry by helping manufacturers to produce printed circuit boards that comply with the new demands brought on by miniaturization, need for high electrical and thermal properties and multiple lamination cycles.
The patented Zeta Cap is a glass free, copper-clad laminate with high glass transition temperature that is meant to prevent pad cratering in circuit boards. Zeta bond is a related glass free bonding film that seals vias and circuits. Another related product is the Zeta Lam, which is a dielectric film that facilitates HDI buildup in ultra thin uniform layers measuring 12 µ. Pad cratering is considered to be a major problem for the printed circuit board industry. It is a resin fracture induced mechanically between the external fiberglass layer and copper foil of the circuit board. It leads to a crater like formation while the pad still remains attached to the component. Zeta Cap prevents pad cratering by functioning as a shock absorber once it is laminated to the surface.
Integral Technology’s President Ken Parent stated that the company brings sophisticated advanced materials to OEMs and printed circuit fabricators. In view of changing dynamics in the industry, the company is helping to redefine the future of electronics.