View the latest innovations in test and inspection from the Nordson Corporation in Booth #407 at SMTA International, scheduled to take place Sept. 24-25, 2019 at the Stephens Convention Center in Rosemont, IL. Highlights will include the new Nordson SONOSCAN Gen7™ AMI system, the most advanced C-SAM, delivering a package of technology, ergonomics, advanced features and analysis.
Nordson YESTECH will display its AOI systems including the FX-940 ULTRA 3D AOI. Offering advanced 3D imaging technology and high-speed PCB inspection with exceptional defect coverage, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
The Nordson DAGE Quadra™ 7 X-ray inspection system that represents the cutting-edge of X-ray inspection performance, allowing features as small as 0.1 µm to be resolved, also will be available for demonstrations.
Nordson’s latest acquisition, optical control will display its X-ray Component Counter. This technology allows for accurate inventory management with real-time connectivity to manufacturing information systems and helps eliminate material shortages, reduces downtime of productions lines and unnecessary handling time, improves inventory management / purchasing cycles, and optimizes warehousing/storage space.
Nordson DAGE, MATRIX, SONOSCAN and YESTECH offer an award-winning portfolio of Acoustic Micro Imaging, Automated Optical Inspection, Automated X-ray Inspection, X-ray Component Counters, Manual X-ray Inspection, Bond Testing, Micro Materials Testing and Wafer X-ray Metrology systems, bringing powerful cost-effective solutions to the PCBA and Semiconductor industries.
Source: https://www.nordson.com/