Insights from industry

Die Attach Adhesives Used in Semiconductor Assembly

Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor assembly.

What are the benefits of using die attach adhesives for semiconductor assembly?

Beyond their ability to form a tight bond between die and various substrates, these adhesives help minimize the impact of mechanical and thermal stress, enhancing long-term product reliability. Among available die-attach materials, epoxy adhesives in particular offer a broad range of characteristics designed to meet the unique requirements of even the most specialized application.

Master Bond Supreme 3HTND-2DA is a single component fast setting epoxy that is well suited for die attach applications.

Master Bond Supreme 3HTND-2DA is a single component fast setting epoxy that is well suited for die attach applications.

Along with their ability to tightly bind die to different materials, adhesives are able to meet complex combinations of requirements for electrical and thermal conductivity as well as a host of other physical characteristics including viscosity, high strength bonds, moisture resistance, low ionic impurities, dimensional stability and more.

How are die attach adhesives used in semiconductor assembly?

After semiconductor wafer fabrication, individual die are separated from the wafer by a precision dicing saw or laser. High-speed die bonders are used to lift each die and place it on a layer of die-attach material spread onto the substrate itself by specialized material dispensers. These dispensers precisely control the volume of material placed on the substrate, typically using vision control systems to ensure proper placement. As the die bonder places the die on the adhesive, it adds a slight and carefully controlled amount of pressure to mate the die to the adhesive-treated substrate.

What happens if the amount of adhesive applied is not exactly right?

If there is too much adhesive, the resulting fillet can flow up the sides of the die and contaminate the circuits etched on the die. If there is too little, the die could lift from the substrate or even crack.

What other properties, in addition to a tight bond, must the die attach adhesives display?

To meet different assembly requirements, epoxies are available with a wide range of delivery options. Today’s two part epoxies go beyond traditional epoxy systems with a range of resin and hardener combinations designed for specific handling times as well as different curing times and temperatures. One part heat curing systems further simplify the assembly process. Delivered as non-premixed and frozen systems, these one part systems help eliminate potential problems such as air entrapment during preparation or concerns about limited pot life/gel time.

What kind of life cycle solutions do die attach epoxies offer for specific applications?

Manufacturers can find die-attach epoxies designed to meet a very wide range of specialized requirements for assembly and lifecycle performance. Die-attach epoxy systems such as Master Bond's offer characteristics suited to a wide range of lifecycle requirements for strength, thermal and electrical conductivity, thermal stability, and more. Specialized epoxies can meet demands as varied as low outgassing performance for space applications to biocompatibility for medical applications as well as continued reliability in applications exposed to mechanical vibration, impact, and shock.

Where can our readers learn more?

To learn more about die attach epoxy adhesives and some of Master Bond's most popular products used for die attach applications such as Supreme 3HTND-2DA, please visit http://www.masterbond.com/industries/die-attach-epoxy-adhesives. If you have a specific application you would like to discuss, please fill out the questionnaire at http://www.masterbond.com/contact and a technical expert will contact you.

Venkat Nandivada

About Venkat Nandivada

Venkat Nandivada has been the Manager of Technical Support at Master Bond Inc since 2010.

He has a Masters in Chemical Engineering from Carnegie Mellon University.

He analyzes application oriented issues and provides product solutions for companies in the aerospace, electronics, medical, optical, OEM and oil/chemical industries.

 

 

 

 

 

 

Disclaimer: The views expressed here are those of the interviewee and do not necessarily represent the views of AZoM.com Limited (T/A) AZoNetwork, the owner and operator of this website. This disclaimer forms part of the Terms and Conditions of use of this website.

Stuart Milne

Written by

Stuart Milne

Stuart graduated from the University of Wales, Institute Cardiff with a first-class honours degree in Industrial Product Design. After working on a start-up company involved in LED Lighting solutions, Stuart decided to take an opportunity with AZoNetwork. Over the past five years at AZoNetwork, Stuart has been involved in developing an industry leading range of products, enhancing client experience and improving internal systems designed to deliver significant value for clients hard earned marketing dollars. In his spare time Stuart likes to continue his love for art and design by creating art work and continuing his love for sketching. In the future Stuart, would like to continue his love for travel and explore new and exciting places.

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