Measuring Bonded Surfaces in the Flip-Chip Bonding Process

The move toward package miniaturization and space-reduction technologies has continued to drive improvements in the overall product performance of new electronic devices. This trend is increasing the use of flip-chip bonding (FCB), a process characterized by a small mounting footprint and reduced wiring distance, in a range of applications.

Understanding the Flip-Chip Bonding Process

Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the need for additional wiring.

Measurement for Bonded Surfaces after Bump Abruption

Au Bump.

As bond alloying results in reinforced bond strength, accurately measuring the area ratio of non-alloy Au electrodes enables inspectors to verify the degree of bond between the circuit board and the bump.

Measuring the Bonded Surfaces with Precision

The Evident DSX1000 digital microscope can achieve resolutions comparable to leading-edge optical microscopes, thanks to the integration of high-NA/low-aberration field lenses.

Extended focal image (EFI) technology enables users to acquire clear images across the whole field, even for difficult-to-focus surface configurations. Images are directly transmitted for measurement via EVIDENT Stream software, where users can further refine the measurement area using the HSV settings.

Brightfield Imagery: 50X field lens with 4X zoom.

Brightfield Imagery: 50X field lens with 4X zoom. 

Manual HSV threshold settings.

Manual HSV threshold settings. 

ROI designation / measurement result.

ROI designation / measurement result.

Products Used for This Application

DSX1000 digital microscope

The DSX1000 digital microscope delivers enhanced images and results, enabling fast failure analysis with accuracy and repeatability.

DSX1000 digital microscope

DSX1000 digital microscope

EVIDENT Stream image analysis software

EVIDENT Stream image analysis software provides rapid, efficient inspection workflows for all process steps, including image acquisition, quantitative measurements, image analysis and reporting, and advanced materials science inspections tasks.

EVIDENT Stream

EVIDENT Stream image analysis software.

This information has been sourced, reviewed and adapted from materials provided by Evident Corporation - Industrial Microscopy.

For more information on this source, please visit Evident Corporation - Industrial Microscopy

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Evident Corporation - Industrial Microscopy. (2022, April 07). Measuring Bonded Surfaces in the Flip-Chip Bonding Process. AZoM. Retrieved on September 27, 2022 from https://www.azom.com/article.aspx?ArticleID=19306.

  • MLA

    Evident Corporation - Industrial Microscopy. "Measuring Bonded Surfaces in the Flip-Chip Bonding Process". AZoM. 27 September 2022. <https://www.azom.com/article.aspx?ArticleID=19306>.

  • Chicago

    Evident Corporation - Industrial Microscopy. "Measuring Bonded Surfaces in the Flip-Chip Bonding Process". AZoM. https://www.azom.com/article.aspx?ArticleID=19306. (accessed September 27, 2022).

  • Harvard

    Evident Corporation - Industrial Microscopy. 2022. Measuring Bonded Surfaces in the Flip-Chip Bonding Process. AZoM, viewed 27 September 2022, https://www.azom.com/article.aspx?ArticleID=19306.

Ask A Question

Do you have a question you'd like to ask regarding this article?

Leave your feedback
Your comment type
Submit