Measuring Bonded Surfaces in the Flip-Chip Bonding Process

The move toward package miniaturization and space-reduction technologies has continued to drive improvements in the overall product performance of new electronic devices. This trend is increasing the use of flip-chip bonding (FCB), a process characterized by a small mounting footprint and reduced wiring distance, in a range of applications.

Understanding the Flip-Chip Bonding Process

Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the need for additional wiring.

Measurement for Bonded Surfaces after Bump Abruption

Au Bump.

As bond alloying results in reinforced bond strength, accurately measuring the area ratio of non-alloy Au electrodes enables inspectors to verify the degree of bond between the circuit board and the bump.

Measuring the Bonded Surfaces with Precision

 

The Olympus DSX1000 digital microscope can achieve resolutions comparable to leading-edge optical microscopes, thanks to the integration of high-NA/low-aberration field lenses.

Extended focal image (EFI) technology enables users to acquire clear images across the whole field, even for difficult-to-focus surface configurations. Images are directly transmitted for measurement via OLYMPUS Stream software, where users can further refine the measurement area using the HSV settings.

Brightfield Imagery: 50X field lens with 4X zoom.

Brightfield Imagery: 50X field lens with 4X zoom. 

Manual HSV threshold settings.

Manual HSV threshold settings. 

ROI designation / measurement result.

ROI designation / measurement result.

Products Used for This Application

DSX1000 digital microscope

The DSX1000 digital microscope delivers enhanced images and results, enabling fast failure analysis with accuracy and repeatability.

DSX1000 digital microscope

DSX1000 digital microscope

OLYMPUS Stream image analysis software

OLYMPUS Stream image analysis software provides rapid, efficient inspection workflows for all process steps, including image acquisition, quantitative measurements, image analysis and reporting, and advanced materials science inspections tasks.

OLYMPUS Stream

OLYMPUS Stream image analysis software.

This information has been sourced, reviewed and adapted from materials provided by Olympus Scientific Solutions Americas - Industrial Microscopy.

For more information on this source, please visit Olympus Scientific Solutions Americas - Industrial Microscopy

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