Image Credits: Bruker Semiconductor Division
At SEMICON West 2017, Bruker’s Semiconductor Division today announced that leading multiple semiconductor manufacturers have ordered JVSensus-600E X-ray Diffraction Imaging Systems for in-line wafer monitoring of crystalline defects. The JVSensus-600E tool is equipped with both high-speed and high-resolution X-ray diffraction imaging (XRDI) measurement capabilities for detecting and classifying a wide range of crystalline defects induced by high-stress processes, such as fast annealing and CMP, or by poor wafer handling. The JVSensus system allows defects to be identified prior to annealing, which is often the critical step that leads to wafer breakage and severe yield loss. By detecting defects early in the process, semiconductor manufacturers can quickly identify the root cause of processes causing wafer breakage and reduce yield loss.
“We are delighted to have been selected by industry-leading customers to provide defect inspection systems for their production yield improvement,” said David V. Rossi, President of the Bruker Semiconductor Division. “We see these shipments as further validation of the value that early detection of critical defects brings to our customers in reduction of wafer breakage."
As the industry utilizes more aggressive steps within more advanced technology nodes, such as fast annealing strategies, new non-visual defect detection challenges arise. The JVSensus-600E system is capable of detecting a wide range of crystalline defects using X-ray diffraction imaging technique, and is optimised for both blanket and pattern wafers on a single system. This allows a fab to efficiently ramp up processes and quickly identify crystalline defects on product wafers to minimize yield loss from wafer breakage in their production line.
Isaac Mazor, Vice President and General Manager, X-ray Semiconductor Business, Bruker