Posted in | News | Business | Adhesives and Sealants | New Product

Indium Corporation Launches InFORMS® ESM02 for Die-Level Bonding

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Mar 1 2019Reviewed

Indium Corporation has launched InFORMS^® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications.

Indium Corporation’s InFORMS^® ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance.

Until recently, InFORMS^® technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS^® include:

Drop-in replacement for other bondline control methods
Increased lateral strength
Bondline co-planarity
Improved thermal cycling reliability
Available in ribbon and preforms

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Standard InFORMS^® Configurations
Description	Standoff (Microns)
LM04	100
LM06	150
LM08	200
SM04	100
ESM03	75
ESM02	50

For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

Source:

http://www.indium.com

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