Plasma Processing Equipment RSS Feed - Plasma Processing Equipment

Plasma processing is family of processes that modify the physical and/or chemical properties of a materials surface. Plasma cleaning is the process whereby contaminants and impurities are removed from the surface of a material. Plasma etching is used to fabricate integrated circuits by selectively removing materials from the sample surface. Other processes include plasma functionalization which modifies the surface to improve adhesion and plasma polymerization which initiates the polymerization process.
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Equipment
The Expanded Plasma Cleaner PDC-001/002 (115/230V) supplied by Harrick Plasma is an inductively coupled device that includes a Pyrex or quartz chamber and a valve assembly to control gas flow.
Oxford Instruments Plasma Technology has been a leading provider of high-volume batch plasma tools in the production market for more than 15 years, with a wide installed base of HBLED production solutions in operation.
The PlasmaProNGP80 is a compact open-loading tool for plasma etch and deposition, offering a range of process technologies
The Orion III Plasma Enhanced Chemical Vapor Deposition (PECVD) system from Trion Technologies produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels.
The PlasCalc Plasma Monitoring System from Ocean Optics can determine plasma emission from 200 to 100 nm in just 3 milliseconds.
PlasmaPro System100 is a powerful and flexible system for deposition and plasma etching processes.
The FlexAL systems from Oxford Instruments Plasma Technology offer a new range of flexibility and ability in the fabrication of nanoscale structures and devices by providing thermal atomic layer deposition (ALD) and remote plasma ALD processes inside a single ALD system.
ESPION from Hiden Analytical is a rapid, versatile electrostatic Langmuir probe. Critical plasma parameters such as ion/electron density, electron temperature distribution and plasma uniformity are automatically measured, giving fast, accurate feedback for plasma processing of materials.
The Apollo plasma cleaning system is a compact, inexpensive and versatile system, which can handle 100-300mm wafers. By employing either ICP or microwave and RF bias power as needed, difficult to remove layers of resist can be removed at low temperatures.
The PlasmaPro System400 is used for single-wafer or batch PVD processing and offers the flexibility of pulsed dc, dc, rf and reactive magnetron sputtering. It finds applications in production or research & development.
The Phantom III RIE (reactive ion etch system) is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries.
The Optofab3000 includes high reflective and anti reflective coatings and is configured similar to the Ionfab300Plus.
The PlasmaPro 800Plus is a flexible solution for plasma etching and deposition processes on large and 300-mm wafer batches, in a compact footprint, open-loading system.
Arc Plasma Deposition (APD) is a unique form of physical vapor deposition that is used for the deposition of uniformly sized nanoparticles (2 nm to 9 nm dia) of platinum and other conductive metals onto micron-size powder substrates.
The PlasmaPro 100 Sapphire, available from Oxford Instruments Plasma Technology, is the latest breakthrough in single wafer etch technology.
Harrick Plasma offers the PlasmaFlo gas flow mixer PDC-FMG/FMG-2 (115/230V) for fine control of process gas, process gas mixing, and monitoring of chamber pressure.
The PlasmaPro Estrelas100 deep silicon etch technology, available from Oxford Instruments, has been designed to provide excellent process performance.
The Sirus T2 Reactive Ion Etcher (RIE) from Trion Technologies is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.
Oxford Instruments Plasma Technology has introduced an evolution in Batch Etch technology with the PlasmaPro1000 Astrea large batch etch system.
Harrick Plasma offers the Basic Plasma Cleaner PDC-32G/32G-2 (115/230V) for surface cleaning and preparation procedures.