Plasma Processing Equipment

Plasma processing is family of processes that modify the physical and/or chemical properties of a materials surface. Plasma cleaning is the process whereby contaminants and impurities are removed from the surface of a material. Plasma etching is used to fabricate integrated circuits by selectively removing materials from the sample surface. Other processes include plasma functionalization which modifies the surface to improve adhesion and plasma polymerization which initiates the polymerization process.
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Equipment
The Orion III Plasma Enhanced Chemical Vapor Deposition (PECVD) system from Trion Technologies produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels.
The PlasCalc Plasma Monitoring System from Ocean Optics can determine plasma emission from 200 to 100 nm in just 3 milliseconds.
The Phantom III RIE (reactive ion etch system) is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries.
The Apollo plasma cleaning system is a compact, inexpensive and versatile system, which can handle 100-300mm wafers. By employing either ICP or microwave and RF bias power as needed, difficult to remove layers of resist can be removed at low temperatures.
The Sirus T2 Reactive Ion Etcher (RIE) from Trion Technologies is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.
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