Plasma Processing Equipment RSS Feed - Plasma Processing Equipment

Plasma processing is family of processes that modify the physical and/or chemical properties of a materials surface. Plasma cleaning is the process whereby contaminants and impurities are removed from the surface of a material. Plasma etching is used to fabricate integrated circuits by selectively removing materials from the sample surface. Other processes include plasma functionalization which modifies the surface to improve adhesion and plasma polymerization which initiates the polymerization process.
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Equipment
The Sirus T2 Reactive Ion Etcher (RIE) from Trion Technologies is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.
The PlasmaPro 100 Cobra inductively coupled plasma (ICP) etch system from Oxford Instruments is designed to handle ICP etching of dielectric, compound semiconductor, metals, and organic materials.
Oxford Instruments’ PlasmaPro 133 ICPCVD380 wafer system is a unique tool capable of producing outstanding uniformity and high rate films. The system can efficiently control film properties such as stress, refractive index, electrical features and wet chemical etch rate.
The Orion III Plasma Enhanced Chemical Vapor Deposition (PECVD) system from Trion Technologies produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels.
The Optofab3000 includes high reflective and anti reflective coatings and is configured similar to the Ionfab300Plus.
Oxford Instruments has developed the PlasmaPro1000 Astrea large batch etch system designed for use in harsh operating environments such as LED applications.
The PlasmaPro 100 highly configurable and reactive ion etching (RIE) system from Oxford Instruments is provided with standalone process chambers comprising load locks or as cluster configurations on hexagonal or square transfer chambers.
Oxford Instruments’ PlasmaPro 80 Stratum is a compact open-loading tool designed specifically for plasma enhanced chemical vapour deposition (PECVD).
The PlasmaPro 80 ICPCVD65 from Oxford Instruments is a compact open loading tool designed to handle plasma enhanced chemical vapour deposition (PECVD), and manufacture high quality uniform dielectric films.
The Phantom III RIE (reactive ion etch system) is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries.
The PlasmaPro 100 inductively coupled plasma chemical vapour deposition (ICPCVD) system is designed to produce high density dielectric films at low temperatures with the capability to deposit onto damage sensitive surfaces.
The PlasmaPro System400 is used for single-wafer or batch PVD processing and offers the flexibility of pulsed dc, dc, rf and reactive magnetron sputtering. It finds applications in production or research & development.
The Apollo plasma cleaning system is a compact, inexpensive and versatile system, which can handle 100-300mm wafers. By employing either ICP or microwave and RF bias power as needed, difficult to remove layers of resist can be removed at low temperatures.
The FlexAL systems from Oxford Instruments Plasma Technology offer a new range of flexibility and ability in the fabrication of nanoscale structures and devices by providing thermal atomic layer deposition (ALD) and remote plasma ALD processes inside a single ALD system.
The PlasmaPro 80 Cobra65 ICP etch system from Oxford Instruments provides flexible plasma etch and deposition solutions on a single platform with easy open loading option.
Arc Plasma Deposition (APD) is a unique form of physical vapor deposition that is used for the deposition of uniformly sized nanoparticles (2 nm to 9 nm dia) of platinum and other conductive metals onto micron-size powder substrates.
The PlasmaPro 800 Stratum from Oxford Instruments is large capacity, open loading plasma enhanced chemical vapour deposition (PECVD) system.
Oxford Instruments Plasma Technology has been a leading provider of high-volume batch plasma tools in the production market for more than 15 years, with a wide installed base of HBLED production solutions in operation.
Oxford Instruments Plasma Technology has introduced an evolution in Batch Etch technology with the PlasmaPro1000 Astrea large batch etch system.
The PlasmaPro 100 Sapphire, available from Oxford Instruments Plasma Technology, is the latest breakthrough in single wafer etch technology.
Harrick Plasma offers the PlasmaFlo gas flow mixer PDC-FMG/FMG-2 (115/230V) for fine control of process gas, process gas mixing, and monitoring of chamber pressure.
The PlasmaPro 800 offers a versatile solution for reactive ion etching (RIE) processes on large wafer batches and 300mm wafers.
Harrick Plasma offers the Basic Plasma Cleaner PDC-32G/32G-2 (115/230V) for surface cleaning and preparation procedures.
The PlasCalc Plasma Monitoring System from Ocean Optics can determine plasma emission from 200 to 100 nm in just 3 milliseconds.
The PlasmaPro Estrelas100 deep silicon etch technology, available from Oxford Instruments, has been designed to provide excellent process performance.
The design of the PlasmaPro 100 Stratum PECVD system is such that it offers superior uniformity and high rate films.
XEI Scientific offers the Evactron® CombiClean™ System that integrates external PRS (Plasma Radical Source) control and onboard vacuum cleaning chamber in a single, unified system.
Oxford Instruments’ PlasmaPro 80 reactive ion etching (RIE) provides flexible reactive ion etch solutions on a single platform with suitable open loading option. It is a compact, small footprint device that is simple to set up and use without compromising on the quality of a process.
ESPION from Hiden Analytical is a rapid, versatile electrostatic Langmuir probe. Critical plasma parameters such as ion/electron density, electron temperature distribution and plasma uniformity are automatically measured, giving fast, accurate feedback for plasma processing of materials.
PlasmaPro 1000- Stratum has been exclusively designed for passivation deposition applications during LED production.
The PlasmaPro 133 Cobra380 380mm ICP etch tool is capable of handling wafer sizes up to 300mm. The tool is provided with carriers for multi-wafer batches.
Oxford Instruments’ PlasmaPro 133 stratum single and multi-wafer plasma enhanced chemical vapour deposition (PECVD) system is exclusively designed to manufacture superior uniformity, high rate films, with the capacity to control film properties such as stress, electrical features, refractive index, and wet chemical etch rate.
The Expanded Plasma Cleaner PDC-001/002 (115/230V) supplied by Harrick Plasma is an inductively coupled device that includes a Pyrex or quartz chamber and a valve assembly to control gas flow.
The PlasmaPro System133 is a reactive ion etch (RIE) wafer processing tool that is designed to handle up to 300mm single wafer and large batches. It provides exceptional uniformity and high throughput for numerous applications and outstanding performance for both R&D and production.
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