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Wafer Mapping System rapidly and automatically creates a map of the magnetic properties of wafers. The Wafer Mapping System is available both as a low-cost manual-loading tool for use in development or limited-production environments and also as a fully-automated tool for use in volume production.
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The new Dektak XTL stylus profiler available from Bruker is designed to accommodate samples up to 350mm x 350mm, bringing the renowned Dektak reproducibility and repeatability to panel and large-format wafer manufacturing.
Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness Imaging™ technology allows Filmetrics to offer easy recipe set up and industry-leading throughput, at a mere fraction of the cost of competing metrology tools.
MaxMile EpiEL system is a virtual LED device fabrication & characterization system which can be used to measure LED device parameters directly on epiwafers. Without any costly and time-consuming device fabrication, yet as through a finished device, EpiEL reveals not only the electro-luminescence (EL) but also the electrical properties of the material.
Electrical characterisation tool for mapping of bricks (or wafers) with mea- surement times of less than four minutes for a 500 mm brick at 1 mm resolution. Completely touch free measurements.
The WT-2000PVN is a tabletop measurement system, capable of performing a variety of measurements on PV cells, wafers, and blocks. The base system includes the overhead functions, and you configure the measurement capabilities to match your specific needs.
Improve the reliability and throughput of your robotic wafer handling systems with the next generation wafer mapping sensors from MultiMetrixs. The most technically advanced and cost effective range of wafer mapping sensors on the market today.
Bruker’s LumiMap Electroluminescence System is a reliable and accurate metrology system and designed for HB-LED epitaxial inspection for R&D and production.
The Signatone QuadPro Process Development Resistivity System is available in both manual and automatic 8" and 12" systems. The manual system includes a ball bearing stage and can be upgraded at a later time to add auto-stepping capability. The automatic systems are motorized and can automatically step through 9, 25, 49, or 121 test points on wafers of size 100 mm, 125 mm, 150 mm, 200 mm, or 300mm.