imec announced that is has expanded its relationship with Qualcomm for continued research on 3D technology.
The collaboration is a part of imec’s INSITE program. With this partnership, Qualcomm receives an early insight on the design impact of advanced technologies such as sub-20 nm node lithography, interconnects and device structures.
Qualcomm has been participating in the imec’s industrial affiliation program (IIAP) since 2008. The 3D integration program allows Qualcomm access to innovative 3D technologies for its next-generation wireless products. The demand for advanced mobile capabilities is increasing rapidly, which is attributed to consumers shift from PCs to mobile devices as well as the growth of the smartphones market. Qualcomm is expected to receive insights into the advantages of 3D integration with sophisticated CMOS technology nodes through the extended collaboration with imec.
imec’s President and CEO, Luc Van den hove pointed out that the INSITE program helps imec to expand its network with fab-lite and fables firms and to interconnect with the design and technology research communities.
imec’s research programs on advanced process technologies are available in various formats and they are used by INSITE to produce information, which can be utilized by product designers. The INSITE program also enables the company to direct specifications for future technologies based on system needs.
Source: http://www2.imec.be/