Nihon Superior, a producer and distributor of metal jointing materials for electronics applications, will exhibit its new soldering products at the JISSO PROTEC 2012 exposition, which will be held in Tokyo, Japan from June 13 to 15.
SN100C P810 D4 lead-free solder paste
SN100C P810 D4, a lead-free solder paste, and solder-coated aluminum ribbon are the new products that will be introduced at the event. These products are designed using SN100C, a lead-free and silver-free solder material, which delivers increased reliability and high productivity.
The SN100C P810 D4 material is used to decrease the voids in large-area solder joints that are found between power semiconductors and substrates. The aluminum ribbon is ideal for application in solar cells, which can leverage the benefit of aluminum’s lower density and lower cost than copper.
Nihon Superior will also showcase several other products, including completely-halogen-free NS-F900 liquid flux, SN100C(044) flux-cored solder wire and SN100C P602 D4, SN100C P603 D4 and SN100C P605 D6 solder pastes.
In addition, the company will feature SN100C Advantage SN99CN series with an addition of low silver at the event. SN100C7A, a lead-free, high melting point solder for use in power modules, and LF-Z3 PF-14 D3, a completely halogen-free Sn-Zn solder paste are the innovative developments of Nihon Superior.
Source: http://www.nihonsuperior.co.jp/