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Kyocera Unveils Room-Temperature Epoxy Molding Compound to Encapsulate Semiconductors

Kyocera Industrial Ceramics’ Chemical Sales Division has reported the launch of its new eco-friendly XKE-G5633 epoxy molding compound.

XKE-G5633 is a room-temperature epoxy molding compound demonstrating an extended shelf life of as high as 3 months, thus enhancing the operation costs for manufacturers. This new epoxy molding compound is suitable for the encapsulation of both land-grid array and ball-grid array semiconductor packages, providing the same superior-quality encapsulation and connectivity of compounds, which must be kept in a frozen state.

On the other hand, Kyocera’s new product can be stored at room temperature, thus can be utilized immediately at all times, which in turn provides customers more options in production planning and eliminates the downtime owing to conventional epoxy molding compound thawing.

The extended three-month shelf life of Kyocera’s XKE-G5633 epoxy molding compound at room temperature enables customers to avoid material losses caused by the drastically shorter shelf life of standard epoxy molding compound products. Kyocera offers this new epoxy molding compound in both bulk and sample delivery options.

Kyocera is actively involved in the advancement of eco-friendly products and strives to decrease the utilization of materials and processes that are harmful to the environment in the industries it serves. Mountain Home, North Carolina-based Kyocera Industrial Ceramics is a specialist in using sophisticated components and materials to address the complex engineering challenges. Kyocera International is the parent company of Kyocera Industrial Ceramics.

Source: http://global.kyocera.com

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