Posted in | News | Semiconductor | Business

Kyocera Unveils Room-Temperature Epoxy Molding Compound to Encapsulate Semiconductors

Kyocera Industrial Ceramics’ Chemical Sales Division has reported the launch of its new eco-friendly XKE-G5633 epoxy molding compound.

XKE-G5633 is a room-temperature epoxy molding compound demonstrating an extended shelf life of as high as 3 months, thus enhancing the operation costs for manufacturers. This new epoxy molding compound is suitable for the encapsulation of both land-grid array and ball-grid array semiconductor packages, providing the same superior-quality encapsulation and connectivity of compounds, which must be kept in a frozen state.

On the other hand, Kyocera’s new product can be stored at room temperature, thus can be utilized immediately at all times, which in turn provides customers more options in production planning and eliminates the downtime owing to conventional epoxy molding compound thawing.

The extended three-month shelf life of Kyocera’s XKE-G5633 epoxy molding compound at room temperature enables customers to avoid material losses caused by the drastically shorter shelf life of standard epoxy molding compound products. Kyocera offers this new epoxy molding compound in both bulk and sample delivery options.

Kyocera is actively involved in the advancement of eco-friendly products and strives to decrease the utilization of materials and processes that are harmful to the environment in the industries it serves. Mountain Home, North Carolina-based Kyocera Industrial Ceramics is a specialist in using sophisticated components and materials to address the complex engineering challenges. Kyocera International is the parent company of Kyocera Industrial Ceramics.

Source: http://global.kyocera.com

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Kyocera International, Inc.. (2019, February 09). Kyocera Unveils Room-Temperature Epoxy Molding Compound to Encapsulate Semiconductors. AZoM. Retrieved on April 20, 2024 from https://www.azom.com/news.aspx?newsID=33577.

  • MLA

    Kyocera International, Inc.. "Kyocera Unveils Room-Temperature Epoxy Molding Compound to Encapsulate Semiconductors". AZoM. 20 April 2024. <https://www.azom.com/news.aspx?newsID=33577>.

  • Chicago

    Kyocera International, Inc.. "Kyocera Unveils Room-Temperature Epoxy Molding Compound to Encapsulate Semiconductors". AZoM. https://www.azom.com/news.aspx?newsID=33577. (accessed April 20, 2024).

  • Harvard

    Kyocera International, Inc.. 2019. Kyocera Unveils Room-Temperature Epoxy Molding Compound to Encapsulate Semiconductors. AZoM, viewed 20 April 2024, https://www.azom.com/news.aspx?newsID=33577.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.