The EVG6200 BA bond alignment systems provide the highest flexibility, accuracy, modular upgrade capability and user-friendliness while being competent in several high-throughput production settings. The accuracy of EVG bond aligners adapts to the most challenging alignment processes in MEMS production and in developing fields such as 3D integration applications.
Features
- Completely motorized high-resolution bottom-side microscopes
- Appropriate for all EVG 200 mm bond systems
- Supports bond alignment of double or triple wafer stacks ranging up to 200 mm wafer sizes
- Manual or motorized alignment stage available with automatic alignment option
- Comes with Windows®-based user interface
- Options
- Automatic alignment
- IR alignment provided for inner substrate key alignment
- NanoAlign® package for improved process abilities
- Upgrade possibility for mask aligner
- Comes with system rack
Technical Data
| . |
. |
General system
configuration |
Desktop
System rack: optional
Vibration isolation: passive |
| Alignment methods |
Backside alignment: ±2 µm 3 σ
Transparent alignment: ±1 µm 3 σ
IR alignment: option |
| Alignment stage |
Precision micrometers: manual
Optional: motorized micrometers
Wedge compensation: automated |
Substrate / Wafer
parameters |
Size: 2", 3", 100 mm, 150 mm, 200 mm
Thickness: 0,1 - 10 mm
Max. stack height: 10 mm |
| Automatic alignment |
Optional |
| Handling system |
Standard: 3 cassette stations
Optional: up to 5 stations |
Source: EV Group