Plasma Processing

The PlasmaPro Estrelas100 deep silicon etch technology, available from Oxford Instruments, has been designed to provide excellent process performance.
The Orion III Plasma Enhanced Chemical Vapor Deposition (PECVD) system from Trion Technologies produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels.
The Optofab3000 includes high reflective and anti reflective coatings and is configured similar to the Ionfab300Plus.
Harrick Plasma offers the Basic Plasma Cleaner PDC-32G/32G-2 (115/230V) for surface cleaning and preparation procedures.
The Apollo plasma cleaning system is a compact, inexpensive and versatile system, which can handle 100-300mm wafers. By employing either ICP or microwave and RF bias power as needed, difficult to remove layers of resist can be removed at low temperatures.
Oxford Instruments Plasma Technology has introduced an evolution in Batch Etch technology with the PlasmaPro1000 Astrea large batch etch system.
The PlasCalc Plasma Monitoring System from Ocean Optics can determine plasma emission from 200 to 100 nm in just 3 milliseconds.
PlasmaPro System100 is a powerful and flexible system for deposition and plasma etching processes.
Arc Plasma Deposition (APD) is a unique form of physical vapor deposition that is used for the deposition of uniformly sized nanoparticles (2 nm to 9 nm dia) of platinum and other conductive metals onto micron-size powder substrates.
The Sirus T2 Reactive Ion Etcher (RIE) from Trion Technologies is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.
The FlexAL systems from Oxford Instruments Plasma Technology offer a new range of flexibility and ability in the fabrication of nanoscale structures and devices by providing thermal atomic layer deposition (ALD) and remote plasma ALD processes inside a single ALD system.
The PlasmaPro 800Plus is a flexible solution for plasma etching and deposition processes on large and 300-mm wafer batches, in a compact footprint, open-loading system.
Harrick Plasma offers the PlasmaFlo gas flow mixer PDC-FMG/FMG-2 (115/230V) for fine control of process gas, process gas mixing, and monitoring of chamber pressure.
The EQP mass spectrometer combines an electrostatic sector energy analyser with a high performance quadrupole mass filter in an instrument designed for plasma diagnostics. The EQP can acquire the mass spectra and energy distributions of neutrals, radicals and ions (positive and negative). Trends in intensity can be plotted against time. Fast acquisition modes mean that transients and afterglows can be studied.
The Expanded Plasma Cleaner PDC-001/002 (115/230V) supplied by Harrick Plasma is an inductively coupled device that includes a Pyrex or quartz chamber and a valve assembly to control gas flow.
The PlasmaPro System400 is used for single-wafer or batch PVD processing and offers the flexibility of pulsed dc, dc, rf and reactive magnetron sputtering. It finds applications in production or research & development.
The PlasmaProNGP80 is a compact open-loading tool for plasma etch and deposition, offering a range of process technologies
Oxford Instruments Plasma Technology has been a leading provider of high-volume batch plasma tools in the production market for more than 15 years, with a wide installed base of HBLED production solutions in operation.
The Phantom III RIE (reactive ion etch system) is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries.
The PlasmaPro 100 Sapphire, available from Oxford Instruments Plasma Technology, is the latest breakthrough in single wafer etch technology.
ESPION from Hiden Analytical is a rapid, versatile electrostatic Langmuir probe. Critical plasma parameters such as ion/electron density, electron temperature distribution and plasma uniformity are automatically measured, giving fast, accurate feedback for plasma processing of materials.