Plasma Processing

PlasmaPro 1000- Stratum has been exclusively designed for passivation deposition applications during LED production.
Oxford Instruments Plasma Technology has introduced an evolution in Batch Etch technology with the PlasmaPro1000 Astrea large batch etch system.
The PlasmaPro 100 Cobra inductively coupled plasma (ICP) etch system from Oxford Instruments is designed to handle ICP etching of dielectric, compound semiconductor, metals, and organic materials.
The Orion III Plasma Enhanced Chemical Vapor Deposition (PECVD) system from Trion Technologies produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels.
The PlasmaPro Estrelas100 deep silicon etch technology, available from Oxford Instruments, has been designed to provide excellent process performance.
The PlasmaPro 100 highly configurable and reactive ion etching (RIE) system from Oxford Instruments is provided with standalone process chambers comprising load locks or as cluster configurations on hexagonal or square transfer chambers.
The Expanded Plasma Cleaner PDC-001/002 (115/230V) supplied by Harrick Plasma is an inductively coupled device that includes a Pyrex or quartz chamber and a valve assembly to control gas flow.
Harrick Plasma offers the Basic Plasma Cleaner PDC-32G/32G-2 (115/230V) for surface cleaning and preparation procedures.
The Evactron® EP de-contaminator is the latest remote RF plasma cleaning system from XEI Scientific as part of XEI Scientific’s E-series.
The PlasmaPro 100 Sapphire, available from Oxford Instruments Plasma Technology, is the latest breakthrough in single wafer etch technology.
The Sirus T2 Reactive Ion Etcher (RIE) from Trion Technologies is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.
The design of the PlasmaPro 100 Stratum PECVD system is such that it offers superior uniformity and high rate films.
The FlexAL systems from Oxford Instruments Plasma Technology offer a new range of flexibility and ability in the fabrication of nanoscale structures and devices by providing thermal atomic layer deposition (ALD) and remote plasma ALD processes inside a single ALD system.
Oxford Instruments Plasma Technology has been a leading provider of high-volume batch plasma tools in the production market for more than 15 years, with a wide installed base of HBLED production solutions in operation.
Oxford Instruments has developed the PlasmaPro1000 Astrea large batch etch system designed for use in harsh operating environments such as LED applications.
The PlasmaPro System400 is used for single-wafer or batch PVD processing and offers the flexibility of pulsed dc, dc, rf and reactive magnetron sputtering. It finds applications in production or research & development.
The Hiden ESPion probe can be used for regular monitoring of the I-V plasma characteristic, which provides direct data relating to plasma reproducibility and stability.
Arc Plasma Deposition (APD) is a unique form of physical vapor deposition that is used for the deposition of uniformly sized nanoparticles (2 nm to 9 nm dia) of platinum and other conductive metals onto micron-size powder substrates.
The PlasmaPro 800 Stratum from Oxford Instruments is large capacity, open loading plasma enhanced chemical vapour deposition (PECVD) system.
The Phantom III RIE (reactive ion etch system) is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries.
Oxford Instruments’ PlasmaPro 80 reactive ion etching (RIE) provides flexible reactive ion etch solutions on a single platform with suitable open loading option. It is a compact, small footprint device that is simple to set up and use without compromising on the quality of a process.
The Apollo plasma cleaning system is a compact, inexpensive and versatile system, which can handle 100-300mm wafers. By employing either ICP or microwave and RF bias power as needed, difficult to remove layers of resist can be removed at low temperatures.
The PlasmaPro 100 inductively coupled plasma chemical vapour deposition (ICPCVD) system is designed to produce high density dielectric films at low temperatures with the capability to deposit onto damage sensitive surfaces.
The Optofab3000 includes high reflective and anti reflective coatings and is configured similar to the Ionfab300Plus.
The PlasmaPro 80 Cobra65 ICP etch system from Oxford Instruments provides flexible plasma etch and deposition solutions on a single platform with easy open loading option.
The PlasmaPro 800 offers a versatile solution for reactive ion etching (RIE) processes on large wafer batches and 300mm wafers.
The Hiden EQP system is a combined mass spectrometer and energy analyser manufactured to handle the analysis of plasma ions, neutrals and neutral radicals.
Harrick Plasma offers the PlasmaFlo gas flow mixer PDC-FMG/FMG-2 (115/230V) for fine control of process gas, process gas mixing, and monitoring of chamber pressure.
The PlasmaPro 80 ICPCVD65 from Oxford Instruments is a compact open loading tool designed to handle plasma enhanced chemical vapour deposition (PECVD), and manufacture high quality uniform dielectric films.
Oxford Instruments’ PlasmaPro 80 Stratum is a compact open-loading tool designed specifically for plasma enhanced chemical vapour deposition (PECVD).
Nordson MARCH's FlexVIA™ Plasma System is a complete self-contained vacuum plasma system that provides a low-cost treatment of flexible materials with excellent efficiency.
XEI Scientific offers the Evactron® CombiClean™ System that integrates external PRS (Plasma Radical Source) control and onboard vacuum cleaning chamber in a single, unified system.