Equipment | Coating Deposition |Atomic Layer Deposition Systems

Atomic Layer Deposition Systems

Atomic Layer Deposition technology enables ultra-thin films of material measuring just a few nanometers thick to be produced – a technique essential for semiconductor engineering. During the ALD process, multiple vapors or gasses react sequentially on a substrate, generating a solid thin film. Many coating systems are set up so an inert carrier gas flows through a chamber system as gas precursors are shot into the carrier in very short bursts. The gas flow acquires the pulses as sequential waves within the reaction chamber. The combined gas then passes through a filtering system. ALD equipment can be precisely calibrated to create layers on a nanometre scale. Many devices allow layers to be applied over a three-dimensional object or large surface area.