Atomic Layer Deposition Systems RSS Feed - Atomic Layer Deposition Systems

Atomic Layer Deposition (ALD) is a coating technique based on Chemical Vapor Deposition (CVD). The main difference is that in ALD a binary reaction is split into two half-reactions in order to achieve a precise control over the film thickness. Atomic layer deposition provides a unique method for depositing ultrathin films on surfaces. This technique uses sequential surface reactions to coat substrates with high conformality and precise thickness control at the atomic scale.

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The PlasmaPro 100 Sapphire, available from Oxford Instruments Plasma Technology, is the latest breakthrough in single wafer etch technology.
WCS-500, a Roll-to-Roll ALD Web Coating system from Beneq, provides accurate roll–to–roll ALD on flexible webs with a maximum width of 500 mm.
TFS 600, an application-specific ALD system from Beneq, has been exclusively developed for vacuum-line integrated OLED encapsulation.
The P800 ALD system available from Beneq is industrially proven, reliable, and built on more than two decades of continuous operation in challenging industrial applications.
SVT Associates' NorthStar™ Atomic Layer Deposition (ALD) system is a versatile research deposition tool for thermal or energy enhanced ALD.
Oxford Instruments Plasma Technology has introduced an evolution in Batch Etch technology with the PlasmaPro1000 Astrea large batch etch system.
Oxford Instruments Plasma Technology has been a leading provider of high-volume batch plasma tools in the production market for more than 15 years, with a wide installed base of HBLED production solutions in operation.
Oxford Instruments has launched an advanced etch and deposition tool called PlasmaPro System133 which delivers excellent performance for both research and development and production.
Oxford Instruments has launched the PlasmaPro 100 Etch and Deposition tool which is a highly configurable system.
Oxford Instruments has introduced a new, compact open-load system that has been specifically designed for Atomic Layer Deposition (ALD).
Thin Film System TFS 500 ALD reactor is designed for thin film processing, protective coating, functional surface buildup and doping purposes. Substrate alternatives include wafers and other planar substrates, powders and porous substrates and complex 3D substrates. TFS 500 can be equipped with a manual load lock for rapid wafer processing. Reactor operates in batch mode. Variable reaction chambers can be fitted to the reactor making it possible to optimize the reaction chamber design depending on the application.
The FlexAL systems from Oxford Instruments Plasma Technology offer a new range of flexibility and ability in the fabrication of nanoscale structures and devices by providing thermal atomic layer deposition (ALD) and remote plasma ALD processes inside a single ALD system.
The TFS 200R thin film system available from Beneq has been specifically designed for depositing thin films on flexible substrates.
The PlasmaPro Estrelas100 deep silicon etch technology, available from Oxford Instruments, has been designed to provide excellent process performance.
The MGC-75 gas cracker makes use of a proprietary, capillary cracking tube for effective disassociation of molecular gases at relatively low temperatures.
MATS sources generate an inductively coupled plasma for the disassociation of various gases that include nitrogen, oxygen, hydrogen and other molecular gases.