(Almelo, The Netherlands) will launch new products and showcase its full range
of innovative X-ray metrology solutions on booth #144 at Semicon Europa 2008,
October 7-9, Stuttgart Trade Fair Centre, Germany.
This premier event will see a PANalytical focus on tools for process control,
pilot manufacture and R&D of semiconductor, MEMS, solar cell and data storage
type of applications. PANalytical is unique in developing ‘backbone’
analytical tools – an approach that provides data that is relevant and
transferable as a material or product moves from R&D through pilot production
to volume lines.
A highlight on the PANalytical booth will be the European launch of an updated
version of the company’s SuperQ 4.0 Thin Film package, for use on the
PW2830 wavelength dispersive XRF system and the Semyos micro-XRF wafer analyzer.
This proven software for thickness, composition and uniformity analysis of thin
films now includes enhanced Fundamental Parameter Software (FP Multi). Best
in class performance across a range of applications is assured, with the analysis
of up to 16 complex layers and the facility to measure and track wafers through
deposition steps to stack completion.
PANalytical’s X-ray diffraction (XRD) range will be represented by the
X’Pert PRO MRD and MRD XL, valuable tools for III-V, and other, types
of solar cells. The X’Pert PRO family is the most flexible XRD solution
available for thin film epitaxial and polycrystalline requirements and is designed
for the rapid analysis of a wide range of structural properties, including film
thickness, lattice mismatch, surface and interface roughness, defect density,
domain size and much more. Unique PreFIX modules allow reconfiguration without
the need for re- alignment.
For semiconductor manufacturers who need tight processes monitoring throughout
the entire production chain, PANalytical’s PW2830 XRF Wafer Analyzer complies
with all current 300 mm standards. Semiconductor and data storage layer composition
and thickness; as well as dopant levels and surface uniformity can be determined
on wafers up to 300 mm in a fully automated environment.
The latest solution for on-product X-ray analysis of thin films, Semyos is
a high-performance, energy dispersive XRF metrology tool with a measuring spot
of less than 23 µm FWHM (Full Width Half Maximum). This enables direct
measurement on production wafers of up to 300 mm. The system covers a wide application
range, including: characterization of films containing elements from Al onwards
in metrology areas in the scribeline, accept/reject assessment of complex stacks,
control of the metallization processes, analysis of barrier films, and characterization
of read/write heads and magnetic media thin films.