Improved Etch Capability for High Brightness LED Market

Published on August 18, 2009 at 2:13 AM

Building on its established reputation for market leading etch hardware, the team at Oxford Instruments Plasma Technology (OIPT) has developed an evolution of its System 133 RIE-ICP380 tool.

The new technology is an active spacer that improves the uniformity of the plasma across the electrode, giving excellent etch results both within wafer and cross batch. A key benefit is that it allows an increase in batch size from 20 x 2" GaN wafers to 27 x 2", or a mammoth 7 x 4" GaN and 18 x 2" Sapphire wafers.

Dr Mark Dineen, Principal Applications Engineer says "OIPT's new spacer offers uniformity tuning at will, which simplifies the process. This allows enhanced process performance and higher throughput, which is essential for our production customers".

The spacer is retrofittable to its systems in the field.

OIPT's well proven System 133 Process Module is built on a 300mm platform, with multibatch capability, and with processes guaranteed to ensure rapid start up during installation. It may be clustered to combine technologies and processes, offering maximum flexibility. With an installed base of over 2000 tools worldwide, OIPT tools boast over 90% uptime.

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