Display and Lighting,
Oxford Instruments Plasma Technology offers flexible, configurable process tools and leading-edge processes for the precise, controllable and repeatable engineering of micro- and nano-structures. Our systems provide process solutions for nanometre layer epitaxial growth of compound semiconductor material, etching of nanometre sized features and the controlled growth of nanostructures.
These solutions are based on core technologies in plasma-enhanced deposition and etch, ion-beam deposition and etch, atomic layer deposition and deep silicon etch. Products range from compact stand-alone systems for R&D, through batch tools and up to clustered cassette- to-cassette platforms for high-throughput production processing.
Plasma Etch and Deposition-ICP, RIE, PECVD, ICP-CVD and sputtering etch and deposition processes using the PlasmaPro product family
Atomic Layer Deposition(ALD) - FlexAL and OpAL ALD systems offering both thermal and plasma atomic layer deposition
Ion Beam Etch and Deposition - Ionfab product family offering a versatile etch and deposition platform for a wide range of materials
Deep Silicon Etch - Our new PlasmaPro Estrelas100 system has been designed with the MEMS R&D market in mind
Oxford Instruments Plasma Technology is committed to supporting our customers’ success. We recognise that this requires world-class products, complemented by world-class service and support. Our global service team is backed by regional offices, offering rapid worldwide support.