Silver Filled Electrically Conductive Adhesives

Master Bond one and two component silver filled electrically conductive compounds feature low volume resistivity and high reliability. They offer high physical strength properties, superior substrate adhesion and uniform electrical conductivity. They are often preferred as lead free substitutes for solder.

The superior performance profile of our silver filled electrically conductive compounds is widely recognized throughout the electronics industry. The cured products offer high physical strength, superior substrate adhesion and uniform electrical conductivity even upon exposure to hostile environmental conditions. Long term durability is excellent. Special grades are vibration and shock resistant, cryogenically serviceable, “snap curing”, offer exceptional peel and shear strength and are screen printable. Additionally, NASA low outgassing approved adhesives and a USP Class VI approved system for medical applications is also available.

Basic Properties

Master Bond’s silver filled adhesives are designed to meet specific performance requirements. Certain grades offer:

  • Chemically resistant
  • Cryogenically serviceable
  • Excellent adhesion
  • Dimensional stability
  • High temperature resistance
  • Low coefficient of thermal expansion
  • Reworkable
  • Screen printable
  • Range of hardness
  • Low outgassing
  • Low shrinkage
  • Low stress
  • Resistance to water
  • Peel strength
  • Durability
  • Thermal cycling
  • Shock resistance
  • Impact resistance
  • Superior electrical conductivity
  • Thermal conductivity
  • Vibration resistance
  • Extra low volume resistivity
  • High Tg
  • Compressive strength
  • Tensile strength
  • Elongation
  • Flexural strength

Major Applications

These products are employed in automotive, medical, appliance, electronic, electrical, microwave, aerospace, and electro-optic industries. Specific applications include:

  • Electrical modules
  • PCBs
  • High frequency shields
  • Wave guides
  • EMI/RFI shielding
  • Entertainment systems
  • Specialty heat sinks
  • Interconnection repair
  • digital signal processors
  • Solar cell manufacturing
  • Electrical ground plane interface
  • RFID tagging
  • Printed wiring board applications
  • LED packaging
  • Wireless headsets
  • Wafer lamination
  • Stack bonding
  • Copper/polymide (PI) circuits
  • Integrated circuitry
  • Flip chip packaging
  • Thermistors
  • Microprocessors
  • Stress control devices
  • Wire tacking
  • SMD attachment
  • Hermetic lid-seal processes
  • Communication systems
  • Electronic test equipment
  • Hybrid packaging
  • Membrane switches
  • Antenna assemblies

Popular Master Bond Formulations for Display Applications

EP77M-F

EP77M-F is a fast setting, silver filled system. Convenient handling. Particularly useful in manufacturing, circuit board repair and other applications where rapid tack is required. Superior bond strength and exceptional low volume resistivity.

EP21TDCSFL

EP21TDCSFL is a two component, silver filled, electrically conductive system with high flexibility and elongation. Serviceable over wide temperature range of 4K to +250°F.

Supreme 10HTFS

Supreme 10HTFS is a one component, no mix, silver conductive system with high shear and peel strength. Snap cure. Very low volume resistivity. Passes NASA low outgassing tests. Cryogenically serviceable. Exceptionally high shear & peel strength.

FL901S

FL901S is a one component, high performance silver filled epoxy adhesive film. Outstanding electrical conductivity and mechanical strength. Serviceable over temperature range of -100°F to 400°F. Easy processing and minimal squeeze out during bonding. Fast cure at moderate temperatures.

Master Bond Polymer System FL901S

Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration is recommended to maximize the shelf life. This specially developed one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure quickly at moderate temperatures e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). The standard thickness is 3 mils, although other thicknesses are available. The film processes very easily and squeeze out during bonding is minimal.

Master Bond FL901S has excellent electrical conductivity over an exceptionally wide temperature range from -100°F to 400°F. Even at elevated temperatures of 300°C the weight loss is less than 0.70%. At room temperature Master Bond FL901S features a low volume resistivity of less than 2 milliohms as well as an excellent thermally conductivity of greater than 10 BTU•in/ft²•hr•°F. It can be used for bonding electronic components onto substrates as well as for applications where EMI/RFI shielding is needed. Master Bond FL901S film adhesive offers the convenience of easy to apply non-mix system along with the high performance profile required in specialty electronic applications. Master Bond FL901S is also available in preformed shapes upon request. Additionally, Master Bond can apply the film directly onto parts supplied and return them to the end user for assembly.

This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.

For more information on this source, please visit Master Bond Inc.

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