PremaSol CS Colloidal Silica Suspensions

PremaSol CS colloidal silica suspensions from Advanced Abrasives contain spherical silica particles in an alkaline (pH 9–11) base formulated to resist drying and reduce the possibility of re-crystallization.

PremaSol CS colloidal silica is supplied by Advanced Abrasives in 80nm or 50nm average particle size and is ideal for Chemical-mechanical planarization (CMP) of semiconductor wafers, sapphire wafers, ceramics, and metallographic specimens.

In the event that PremaSol CS colloidal silica is inadvertently left to dry for a long period of time on a polishing cloth or on a workpiece, it will dry soft, reducing the possibility of subsequent scratching.


The main applications for PremaSol CS colloidal silica include:

  • Chemical-mechanical planarization (CMP) of sapphire wafers
  • Chemical-mechanical planarization (CMP) of Silicon wafers and other semiconductor materials
  • Ceramics
  • Quartz
  • Gallium nitride
  • Final polishing of metallographic specimens

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