PremaSol CS colloidal silica suspensions from Advanced Abrasives contain spherical silica particles in an alkaline (pH 9–11) base formulated to resist drying and reduce the possibility of re-crystallization.
PremaSol CS colloidal silica is supplied by Advanced Abrasives in 80nm or 50nm average particle size and is ideal for Chemical-mechanical planarization (CMP) of semiconductor wafers, sapphire wafers, ceramics, and metallographic specimens.
In the event that PremaSol CS colloidal silica is inadvertently left to dry for a long period of time on a polishing cloth or on a workpiece, it will dry soft, reducing the possibility of subsequent scratching.
The main applications for PremaSol CS colloidal silica include:
- Chemical-mechanical planarization (CMP) of sapphire wafers
- Chemical-mechanical planarization (CMP) of Silicon wafers and other semiconductor materials
- Gallium nitride
- Final polishing of metallographic specimens