Cleaving Kit without Mat

LatticeGear provides the complete tool set for scribing and cleaving neatly, an important step in obtaining the best cross-sections–the LatticeGear Cleaving Kit-without mat. It can be used on a wide variety of substrates and wafers such as Si, GaAs, and glass.


  • Diamond Scribe-pen style
  • Diamond Scribe-straight tip
  • Diamond Scribe-30° tip
  • Tweezers with black soft fiber fine tip (length 6 ¼”)
  • CleanBreak Pliers-wafer cleaving pliers
  • Small ruler mat-self healing, small wafer piece ruler mat
  • Clear plastic ruler with metric and US units
  • Tungsten cleaving wire
  • Price: US$274.60

Cleaving Kit without Mat

Picture 1
Picture 2

Other Equipment by this Supplier