LatticeGear provides the complete tool set for scribing and cleaving neatly, an important step in obtaining the best cross-sections–the LatticeGear Cleaving Kit-without mat. It can be used on a wide variety of substrates and wafers such as Si, GaAs, and glass.
Specifications
- Diamond Scribe-pen style
- Diamond Scribe-straight tip
- Diamond Scribe-30° tip
- Tweezers with black soft fiber fine tip (length 6 ¼”)
- CleanBreak Pliers-wafer cleaving pliers
- Small ruler mat-self healing, small wafer piece ruler mat
- Clear plastic ruler with metric and US units
- Tungsten cleaving wire
- Price: US$274.60