In addition to everything in the Wafer Cleaving Kit (CSK-200M-LG), The Cleaving Station includes a 12” x 18” self-healing cutting mat, two diamond scribes for marking and scribing, one pen style diamond scribe, and cleaving pliers. The kit also includes the Lattice Scriber customized with an eight-point diamond scribe, suitable for scribing at any angle, and the LatticeGear small cleaving pliers that provide a clean cleave on both very small samples and samples as large as 300 mm.
Specifications
- Diamond Scribe-pen style
- Diamond Scribe-straight tip
- Diamond Scribe-30° tip
- Lattice Scriber diamond scriber customized with an 8-point diamond tip
- Tweezers with black soft fiber fine tip (length 6 ¼”)
- CleanBreak Pliers-wafer cleaving pliers; three sets of jaws (two running for crystalline substrate and 1 nipping for glass and ceramic)
- Small Sample Cleaving Pliers (GC-SS-100)
- Large 18” x 12” Cutting Mat-self healing, wafer cutting mat
- Small ruler mat-self healing, small wafer piece ruler mat
- Clear plastic ruler with metric and US units
- Tungsten cleaving wire
The Cleaving Station with Mat