EX-300 Shallow Probe Semiconductor Metrology Tool from CAMECA

CAMECA's new generation Shallow Probe: the metrology solution for advanced integration of new processes.

The EX-300 benefits from over a decade of experience with LEXES technology in the semiconductor industry: dozens of LEXFAB-300 Shallow Probes have been installed at the top-ten semiconductor fabrication facilities worldwide. The EX-300 is targeted for new challenging applications such as SiGe and HKMG, and it is designed to accelerate the time to marketof advanced logic & memory devices while achieving high production yield.

The tool of choice for front-end process issues at 32nm node and beyond

The non-contact, non-destructive LEXES technique is a unique solution for direct measurement of the chemical composition at the surface and near surface.

The EX-300 offers a panel of complementary capabilities enlarging the domains of classical metrology to current challenging processes:

  • Ultra shallow implants: Monitoring of low energy, high concentration implants.
  • Strained silicon process control:Chemical composition and thickness in epitaxial layers such as B:SiGe andP:SiC, with no limitation in the layer composition.
  • HKMG metrology: Both the oxydes and the metal are controled by one single EX-300 platform.

CAMECA's EX-300 delivers enhanced long-term stability with better vacuum limit. The below graph shows reproducibility over several months for an average As dose of 1.97e15 at/cm2 with a global RSD (1σ) of 0.622%.

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