Oxford Instruments Receive Tier 1 Orders for Indium Phosphide High Volume Manufacturing Solution

To support demand from high-growth markets like communications and sensors, InP processing capability is getting more advanced with a higher degree of automation, with the industry also looking to 6” to increase die per wafer.

Image Credit: Oxford Instruments Plasma Technology

Oxford Instruments are enabling this transition utilising their high temperature electrostatic clamping (Hot ESC) for the PlasmaPro 100 Cobra ICP etch module, part of their market-leading range of ICP InP etch processing solutions. The Hot ESC capability from 75 mm wafer size and up, is a full automation-compatible solution, which reduces manual processing for increased reliability and repeatability, which is critical at larger wafer sizes and with more complex processes.

Oxford Instruments have developed leading edge processes, supported by next generation hardware, and this leading position has been recognised with orders received from Tier 1 customers. The solution is in high demand and is ready to enable automated processing and larger wafer sizes. The orders from leading European and Asian optical module and integrated device manufacturers, are supported by excellent InP market growth projections and expansion of manufacturing capacity to meet anticipated demand. Datacom and telecom are, and will continue to be the two biggest segments in the market, but consumer and wearable sensors will also contribute to an attractive 14% CAGR in revenue expected for the InP photonics market (Yole 2022).

As market leading suppliers of InP processing equipment and solutions, we are attending Photonics West 2023 in San Francisco. Our experts will share the latest advances in optoelectronics, photonics, laser and quantum. Meet us there so we can discuss how our ICP InP process solutions and Ion Beam slanted facet etch capability can enhance your projects and meet your technical challenges.

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