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Results 1571 - 1580 of 1607 for Packaging films
  • Article - 6 Jan 2004
    Cellulose fibres are also knhown as Rayon or Viscose and films as Cellophane. Chemical, electrical, mechanical and physical properties are listed for regenerated cellulose. Data is also provided for...
  • Equipment
    The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition.
  • Article - 26 May 2003
    Chemical, electrical, mechanical, physical and thermal properties are provided for polyvinylidenechloride (PVDC). Applications are also outlined.
  • Article - 19 Mar 2003
    A concise report on the state of play of the gold market relating to industrial applications. Current and future devlopments for the elcteronics biomaterials/dental, pharamaceuticals and catalyst...
  • Article - 20 Aug 2001
    Properties such as low density, good strength at elevated temperatures, high strength and excellent corrosion resistance have seen titanium used extensively in industries such as aerospace, process...
  • Article - 26 Jul 2001
    This article provides details on how aluminium nitride is produced, key properties and its applications, including microelectronics.
  • Article - 5 Jun 2001
    Paper, natural fibres, glass, metals and many plastics are used as packaging materials. The reasons for their use and developments in the packaging industry are explained.
  • Article - 7 May 2001
    Exhibits better weathering characteristics than Cellulose Acetate or Cellulose Propionate. Is tougher than Cellulose Acetate. Advantages, diadvantages and applications are listed together with a...
  • Article - 7 May 2001
    Transparent, glossy and reasonably hard for a thermoplastic. Has reasonable impact resistance at low temperatures. Advantages, diadvantages and applications are listed together with a table of...
  • Article - 3 Apr 2001
    Parylenes (or parxylylenes)are a family of polymers that can be used as a protective coating. They can be used for protection of artefacts as well as in the electronics and medical industries.