Microelectronics Failure Analysis Desk Reference, 6th Ed (Book & CD set)
This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.
Topic coverage includes:
- Failure Analysis Process Flow
- Failure Verification
- Failure Modes and Failure Classification
- Special Devices (MEMS, Optoelectronics, Passives)
- Fault Localization Techniques: Package Level (NDT)
- Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)
- Deprocessing & Imaging Techniques: Deprocessing
- General Imaging Techniques
- Local Deprocessing & Imaging
- Circuit Edit and Design Modification
- Material Analysis Techniques
- Reference Information: Important Topics for Semiconductor Devices
- Failure Analysis Techniques Roadmap
- Failure Analysis Operations and Management
- Appendices: Failure Analysis Terms, Definitions, and Acronyms
- Industry Standards
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