Product Description
This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.
The new edition contains approximately 90% new or updated material. It has a section devoted to special devices such as microelectromechanical systems (MEMS), optoelectronics, and passive devices, expanded sections on depackaging and deprocessing, and an important new section on failure analysis process flow from system level to die level. The section on design verification and circuit editing has been expanded.
Contents: Introduction/Overview:
- Failure Analysis Process Flow
- Failure Verification (Bench and Test)
- Failure Modes and Failure Classification
- Special Devices (MEMS, Optoelectronics, Passives)
- Fault Localization Techniques: Package Level (NDT)
- Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods) ● Deprocessing & Imaging Techniques: Deprocessing ● General Imaging Techniques
- Local Deprocessing & Imaging
- Circuit Edit and Design Modification
- Material Analysis Techniques
- Reference Information: Important Topics for Semiconductor Devices
- Failure Analysis Techniques Roadmap
- Failure Analysis Operations and Management
- Appendices: Failure Analysis Terms, Definitions, and Acronyms
- Industry Standards
Published: 2004
799 Pages
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