Oxford Instruments’ global work with commercial and academic organizations sees the company leverage its market-leading scientific technology and expertise across a wide range of key market segments, from materials analysis and semiconductors to life sciences and healthcare.
Innovation underpins Oxford Instruments’ success and growth, supporting its core goal of driving breakthroughs that hope to offer the world a brighter, greener, healthier, and more productive future.
This work is driving unprecedented levels of R&D investment in new materials and techniques designed to support decarbonization and productivity worldwide, resulting in the creation of a significant opportunity for Oxford Instruments’ continued growth.
The company holds a unique position in the current market, allowing it to power real-world progress by predicting global drivers and connecting academic researchers with commercial applications engineers.
Since being founded in 1959 as the first technology business spun out from Oxford University, Oxford Instruments has grown into a global company listed on the FTSE250 index of the London Stock Exchange (OXIG).
Plasma Technology
Oxford Instruments Plasma Technology works with the compound semiconductor industry, designing, manufacturing, and delivering leading-edge plasma processing solutions and applications.
Its primary technology offerings include conventional plasma deposition and etch, on-beam deposition and etch, plasma-enhanced atomic layer deposition (PEALD), and atomic layer etch (ALE).
The company’s product portfolio features compact, highly flexible systems suitable for research and development, alongside batch tools and clustered cassette-to-cassette platforms suitable for high-throughput production processing.
Oxford Instruments Plasma Technology’s products and solutions continue to be at the forefront of device performance improvement via material interface optimization and engineering.
These developments drive progress in some of the high-growth markets’ most ground-breaking applications, including areas such as power semiconductors, datacom, quantum, 3D sensing, and augmented reality.
Semi Interface Magazine
Oxford Instruments’ Semi Interface magazine highlights the company’s commitment to its work in these fields. Issue four of the magazine focuses on power, exploring how silicon carbide (SiC) and gallium nitride (GaN) are reshaping photonics, power electronics, and advanced manufacturing.
Dr. Arne Benjamin Renz starts by outlining a collaboration between Oxford Instruments and the University of Warwick, highlighting its work to improve SiC device interfaces via trench etch, atomic layer etch, and deposition.
Matt Kelly shares insights into the effect of Oxford Instruments’ work with Singapore’s NSTIC GaN initiative, as well as a report on the SEMICON Southeast Asia panel’s discussion on quantum technologies featuring Bas Derksema.
An article about the use of plasma ALD silicon nitride (SiN) in developing GaN and SiC power devices is also featured, outlining how this innovative approach enables high reliability and manufacturability.
Interviews with Dr. Vijay Ramya Kolli and Professor Anant Agarwal, Ian Wright, Dr. Kolja Haberland, and Dr. Hwan-Won Oh provide further insight into South Korea’s shift towards atomic-scale plasma process control.
Dr Emma Coleman considers the use of SiC in augmented reality, highlighting its potential to enable high-performance waveguides with excellent durability, display clarity, and user comfort for immersive experiences.
SiC and GaN continue to evolve into strategic design platforms as opposed to simple material upgrades. The stories presented throughout this issue of Semi Interface magazine clearly show how SiC and GaN are not just enabling technologies; instead, they are transforming multiple industries.
This information has been sourced, reviewed and adapted from materials provided by Oxford Instruments Plasma Technology.
For more information on this source, please visit Oxford Instruments Plasma Technology.