Master Bond Adhesive EP79FL for Circuit Board Applications

Keeping an eye toward the budget, Master Bond EP79FL has a cost-conscious silver coated/nickel filled formulation that provides outstanding electrical conductivity. With extremely low volume resistivity of less than 10-2 ohm-cm, this two component epoxy is ideal for demanding bonding and sealing applications in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries among others.

EP79FL offers convenient handling with a one-to-one mix ratio, by weight or volume. The system has an open time of 60-75 minutes for a 100 gram mass and cures at room temperature in 24-48 hours or more rapidly at elevated temperatures. Once cured, this system readily develops a high bonding strength of more than 850 psi tensile shear and a T-peel of greater than 20 pli when cured and measured at 75°F.

Its high flexibility and elongation are also noteworthy features. Its exceptional flexibility makes EP79FL particularly useful in bonding dissimilar substrates that are being thermally cycled and shocked. Additionally, its high flexibility combined with its inherently low shrinkage enables the cured system to exert very little mechanical stress on sensitive components and substrates. Also, the highly flexible EP79FL is easier to remove than most silver coated/nickel filled epoxies, making it well suited for repair type applications.

Master Bond EP79FL has a smooth paste consistency and can be easily applied with minimal sagging on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents. However, it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent by weight such as xylene, acetone, MEK, etc, if desired. As a sealant, it resists a wide range of chemicals including water, oils and most organic solvents over the exceptionally wide temperature range of 4K to +250°F enabling it to be serviceable even in cryogenic applications. Adhesion to metals, glass, ceramics, rubbers and many plastics is excellent.

Printed Circuit Board (PCB)

From conformal coatings to surface mount adhesives or from conductive films to thermal management products, Master Bond is leading the way in printed circuit board applications. The Master Bond line of epoxies, silicones, polyurethanes, polysulfides, cyanoacrylates and UV cures feature innovative solutions to challenging industry requirements.

Benefits of Master Bond Electronic Grade Compounds

Master Bond is actively engaged in developing new products for advanced electronic systems. Master Bond compounds offer the following advantages:

  • Widest range of formulations
  • Consistent reproducible high performance systems
  • Latest technology
  • Easy application—simple packaging (including premixed and frozen syringes)
  • Available direct from manufacturer
  • Custom formulations available

Cutting Edge Formulations

The Master Bond product line consists of advanced epoxies, silicones, polyurethanes, polysulfides, UV/LED cures and other specialty systems. Each compound is designed to meet specific application requirements. Master Bond’s environmentally friendly systems are available in convenient packaging from small to large sizes.

Outstanding Technical Support

With years of experience in technical support, the Master bond team will be able to assess your application and recommend the most suitable polymer system to meet your specifications. Master Bond will continue to guide you throughout the design, prototype and manufacturing process. Master Bond offers replacements for discontinued products.

Latest Technological Advancements

As a worldwide manufacturer of polymer compounds, Master Bond is continuously working with universities and R&D labs to improve product performance. Master Bond products are designed to maximize productivity, reduce waste, save energy and for dependable, long term durability.

This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.

For more information on this source, please visit Master Bond Inc.

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