Oxford Instruments Applications Specialist Stephanie Baclet will be addressing the issues of high throughput and high yield in her talk entitled, "High throughput for resist coated Gallium Nitride etching" at the Strategies in Light Conference, taking place in Santa Clara, USA this week.
High throughput in batch GaN based LED production is determined principally by batch size, process time and the uptime of the tool in operation. As the time of the etch process is often fixed in order to meet selectivity, uniformity and profile specifications, one area where throughput can be significantly improved is by reducing the cleaning cycle thus improving the tool’s uptime.
This talk examines the work being undertaken by Oxford Instruments in order to improve the plasma cleaning process, by utilising new chamber hardware for the PlasmaPro 1000 batch etch tool. This new design has been shown to clean the chamber at up to 5 times the rate compared with the standard plasma clean. As a result the two main positive outcomes are that the length of plasma clean may be dramatically reduced, and the mechanical clean interval is increased. Both of these factors contribute to significant gains in the overall throughput of batch processing GaN wafers, driving down the cost per lumen of the finished device.
Oxford Instruments is playing an important role in the manufacture of HBLEDs, enabling huge changes in the global lighting industry. The company’s PlasmaPro1000 systems, capable of etching batch sizes of 55 x 2” and 14 x 4” GaN wafers, with high uniformity, and selectivity, are used by a number of major HBLED manufacturers providing market leading device performance and driving down cost of ownership. They are also used in the manufacture of other light emitting technologies e.g. OLEDs providing process solutions from R&D to full scale production.
About Oxford Instruments Plasma Technology
Oxford Instruments Plasma Technology offers flexible, configurable process tools and leading-edge processes for the precise, controllable and repeatable engineering of micro- and nano-structures. Our systems provide process solutions for the etching of nanometre sized features, nanolayer deposition and the controlled growth of nanostructures.
These solutions are based on core technologies in plasma-enhanced deposition and etch, ion-beam deposition and etch, atomic layer deposition, deep silicon etch and physical vapour deposition. Products range from compact stand-alone systems for R&D, through batch tools and up to clustered cassette-to-cassette platforms for high-throughput production processing.