This week, at the 2026 IEEE / JSAP symposium on VLSI Technology & Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents two advances in ferroelectric memory research, targeting both ferroelectric capacitors and ferroelectric field-effect transistors as emerging candidates to enable low-voltage operation and high-density integration.
Inside computer chips are billions of tiny transistors made from silicon.
Researchers developed a glaze-inspired CoO–Cr2O3 ceramic coating that self-heals thermally induced cracks through cobalt oxide phase segregation at elevated temperatures. The coating mimics protective cobalt-superalloy glaze layers, improving crack tolerance and supporting high-temperature tribological performance for gas turbine engine surfaces.
Researchers identified galvanic corrosion between deposited zinc and current collectors as a major, previously underappreciated cause of irreversible zinc loss in anode-less aqueous zinc batteries. A PVDF/CeF3 hybrid interface suppressed corrosion, guided dense zinc deposition, and enabled longer cycling, lower self-discharge, and pouch-cell energy densities exceeding 90 Wh L?¹.
Researchers developed SG-CDVAE, a symmetry-aware generative AI framework that embeds space-group information into the generation of crystal structures to improve the search for high-symmetry antiferromagnets. From 110,000 generated structures, the workflow identified 80 high-symmetry AFM candidates, of which 4 were computationally validated as thermodynamically and dynamically stable.
Solar technology as long been regarded by some in the maritime industry as too fragile to withstand the demanding conditions at sea.
The pharmaceutical and biopharmaceutical industries increasingly require rapid, accurate, and high-resolution analytical tools to characterize complex materials, ensure product quality, and accelerate innovation.
Forge Nano, Inc., a leading U.S. based semiconductor equipment and advanced materials company pioneering Atomic Layer Deposition ("ALD") technology for artificial intelligence ("AI")-era chip manufacturing and defense battery applications, which has signed an agreement to merge with Archimedes Tech SPAC Partners II Co. ("Archimedes II"), today announced that a leading commercial photonics technology company has selected Forge Nano's TEPHRA™ semiconductor wafer fabrication platform to support the manufacturing of advanced integrated photonic devices.
Researchers developed a deep neural network framework that predicts hafnium oxide thin-film thickness, refractive index, and wet etch rate from atomic-layer-deposition process conditions and wafer location. The model generated process-property maps that could accelerate ALD optimization while supporting future digital twin-guided semiconductor manufacturing.
Researchers developed regenerated cellulose fibers inspired by cherry bark’s helical architecture, using microfluidic spinning to create a biaxially oriented structure with spider silk-like toughness. The fibers reached 553 MPa tensile strength, 41% fracture strain, and 184 MJ m?³ toughness, and could be woven into durable fabrics for future sustainable textiles and structural materials.
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