Posted in | Materials Research

Zeiss Highlights Microscopes and Imaging Solutions at Semicon West 2015

ZEISS announces they will be highlighting a range of microscopes and imaging solutions at SEMICON West 2015, July 14-16, 2015, at the Moscone Center, San Francisco, CA.

Visit Booth #5449 in the North Hall to see ZEISS Smartzoom 5 automated digital microscope, ZEISS Stemi 508 stereo microscope, and ZEISS Axio Imager for polarized light microscopy. Visitors to the booth can also view demonstration videos of electron and X-ray microscopy, as well as photomask solutions developed by the ZEISS Semiconductor Metrology Systems (SMS) strategic business unit.

ZEISS will be showcasing ZEISS Smartzoom 5, an automated digital microscope ideal for optical inspection in an industrial environment. Used for production-related quality testing, ZEISS Smartzoom 5 is the perfect choice for inspecting such parts as screws, printed circuit boards, and metal elements and examining them for defects. It is also especially well-suited for conducting failure analyses, as well as conducting routine inspections, during which a material sample must be repeatedly inspected using the same workflow.

ZEISS Stemi 508 Greenough-type stereo microscope on display is equipped with apochromatic optics and designed for heavy workloads. The compact, reliable ZEISS Stemi 508 is great for acquiring images of outstanding image contrast and color accuracy. With the large object field (up to 36 millimeters (mm)), users always keep the overview of their sample.

Visitors to the booth can also view ZEISS Axio Imager for polarized light microscopy, which is ideal for time-dependent measurements and high magnifications where stability is a must. The nosepiece turret, z-guide, and stage carrier have been designed as a compact, vibration-free unit, isolated from the rest of the stand. This stable cell creates ideal measurement conditions for superb results.

Also at the booth will be a series of videos demonstrating unique solutions developed by ZEISS SMS for mask making and lithography in the areas of zero defect, in-die metrology, critical dimension/registration, and overlay control to achieve high mask yield improvement and mask recovery.

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