Well suited for large potting and encapsulation applications, Master Bond EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties.
Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a pot life of 7-9 hours at room temperature for a 100 gram mass. Upon curing, EP29LPAO exhibits low exotherm, even in large volumes. This dimensionally stable formulation has low shrinkage upon cure, both linearly and volumetrically.
EP29LPAO delivers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)] and superb electrical insulation values, including a volume resistivity exceeding 1015 ohm-cm. Additionally it offers an outstanding high strength profile, with a tensile modulus of 450,000-500,000 psi and a compressive strength of 24,000-26,000 psi at 75°F. This product bonds well to a wide range of substrates such as metals, glass, ceramics and many plastics. EP29LPAO cures at room temperature or more rapidly at elevated temperatures. An optimum cure schedule is overnight at 75°F followed by 4-5 hours at 150°F.
Often used in the aerospace, electronic, electrical and specialty OEM industries, EP29LPAO is serviceable from -60°F to +250°F. It resists chemicals including water, fuels and oils. This off-white colored system is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits as well as premixed and frozen syringes.
Master Bond Low Exotherm Adhesives
EP29LPAO is a low viscosity epoxy system that features a long working life, reliable electrical insulation and low exotherm suitable for large potting and encapsulation applications. Read more about Master Bond’s low exotherm adhesives at http://www.masterbond.com/properties/low-exothermic-epoxy-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: [email protected].