Transmission Kikuchi Diffraction (TKD) is an electron backscatter diffraction technique that can characterize phase and orientation information in nanostructured materials.
Keller and Geiss collected the first data more than a decade ago. Since then, the approach has progressed and is now widely utilized as a solution for boosting spatial resolution when the limitations of standard EBSD are reached.
TKD analysis is performed on an electron-transparent material, and the diffraction signal is generated from the lower side of the sample, resulting in a setup different from traditional EBSD.
The early TKD work was done with traditional EBSD gear and software, which necessitated changes to band recognition and indexing methods to deal with distortions and larger bands in the diffraction pattern.
This tutorial shows how to improve TKD analysis using the Near Axis TKD (NA-TKD) solution, which includes new geometry and detector hardware. It also discusses the differences from traditional TKD, the benefits of this technology, and how it can enhance the capabilities of your CMOS EBSD system.
Watch the webinar to discover:
- What is located near Axis TKD
- How this solution can improve your applications
- How to change screens between EBSD and NA-TKD setups
Speakers
Kim Larsen, Oxford Instruments: Senior Product Scientist
Kim Larsen joined HKL Technology A/S in January 2004. Oxford Instruments acquired the company the next year.
Kim has worked in a variety of roles at HKL Technology A/S and later Oxford Instruments, including Customer Support, Development, and Marketing, with a strong emphasis on EBSD. He is currently employed as a Senior Product Scientist in the Product Science group.
Dr. Mark Coleman, Oxford Instruments: EBSD Product Manager
Mark Coleman is the EBSD product manager for Oxford Instruments NanoAnalysis. He received his PhD from Swansea University, where he focused on employing EBSD to investigate grain boundary engineering methods.
As a Senior Lecturer, he was also the Program Director for the Materials Science and Engineering department and collaborated extensively with industry on the use of SEM-based techniques for materials failure investigation. He has recently focused on merging EBSD with in-situ heating and micromechanical testing.