Equipment | Physical Properties Testing | Semiconductor/Wafer Metrology Tools

Semiconductor/Wafer Metrology Tools

With electronics getting smaller and smaller the demands on semiconductor manufacturers are increasing. To ensure the quality and consistency of substrates, wafer manufacturers employ metrology tools to control the quaility of their materials. Metrology tools for the semiconductor industry may include a variety of technologies and instruments such as wafer probes, AFMs, SEMs, profilometers and ellipsometers.
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Equipment
Phemos 200 Emission Microscope from Hamamatsu for Failure Analysis
The Phemos-200 developed by Hamamatsu is an emission microscope which consists of a high-resolution, cooled CCD camera with a pixel of about 1024×1024.
EX-300 Shallow Probe Semiconductor Metrology Tool from CAMECA
CAMECA's new generation Shallow Probe: the metrology solution for advanced integration of new processes.
Hamamatsu THEMOS 1000 - Thermal Emission Microscope for Semiconductor Failure Analysis
TriPhemos Time-Resolved Imaging Emission Microscope from Hamamatsu
The TriPhemos Time-Resolved Imaging Emission Microscope is suitable for analyzing the circuit timing by detecting the faint light which is generated when CMOS transistors operate using a two-dimensional infrared detector, thus analyzing the device timing with picosecond precision.
Phemos 1000 High Resolution Emission Microscope with IR Confocal Laser Scan Microscope from Hamamatsu
Automated Wafer Metrology and Measurement Tool from FRT
The new FRT MHU Automated Wafer Metrology and Measurement Tool is a multi-cassette wafer metrology tool for the fully automated inspection of wafers. The tool accepts wafers from 2” up to 8” in diameter and has been designed from ground-up to accommodate the latest metrology workflow and standard requirements in the wafer fab. All components harmonize perfectly to assure superior uptime, throughput and precision.
iPhemos-SD Inverted Emission Microscope from Hamamatsu for Semiconductor Inspection
Hamamatsu offers the iPhemos-SD Inverted Emission Microscope which is suitable for docking with different types of testers.
Proforma 300 Semiconductor Metrology System from MTI Instruments
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
Hamamatsu µAMOS-1000 IR-OBIRCH Semiconductor Failure Analysis System
Hamamatsu offers the IR-OBIRCH Analysis System which is a semiconductor failure analyzer.
Automated Wafer Metrology Tool from DWFritz Automation
This sophisticated, flexible wafer metrology system combines a MicroEpsilon profilometer with a high-performance, high-resolution vision system and laser interferometers to detect and measure laser-cut features on one side of a wafer relative to features on the other side of the wafer.
Surface and Thickness Measurement Tool - The FRT MicroProf® TTV
The FRT MicroProf® TTV is a metrology tool for surface and thickness measurements of wafers or similar products. Parts up to 300 mm diameter are measured with a resolution of 10 nm for the thickness measurement. Surface roughness and 3D structures can be measured on both specimen sides simultaneously.
Themos Mini Thermal Emission Microscope from Hamamatsu
THEMOS mini is a thermal emission microscope which is designed by Hamamatsu. It is suitable for indicating the occurrence of failures in the semiconductor device by displaying the detected thermal image superimposed onto the pattern image.
Proforma 300SA Semi-Automated Wafer Characterization System from MTI Instruments
Semi-automated wafer characterization system for determining wafer thickness, TTV, bow warp, site and global flatness measurement. The Proforma 300SA can be used for all wafer materials and accommodates 200mm and 300mm wafer diameters.
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