Feb 17 2004
Background
Tin/silver alloys were developed as an alternative to lead-containing solders. Typical commercial tin/silver alloys contain between 3 and 5% silver.
Tin/Silver solders are used for high temperature, high reliability interconnect applications. Solder joints using Tin/Silver alloys maintain better high temperature strength then tin/lead solders.
Key Properties
The Tin 96.5/Silver 3.5 eutectic has a melting point of 221°C.
The Tin 95/Silver 5 alloy has slightly higher melting point.
Applications
Tin/Silver solders are used for:
• Electronic assemblies
• Die attachments
• Thick films
• Soldering applications where lead use is prohibitive such as pipe joints that come into contact with water and/or foodstuffs
• Central heating and hot water pipes where temperatures are high and temperature changes can result in sudden contraction in the solder joint.
• Soldering of jewellery due to the alloys ability to maintain high levels of brightness
Primary author: AZoM.com