One Component Epoxy Underfill Compounds

Master Bond has formulated a line of one component epoxy underfill compositions which feature rapid cures at moderately elevated temperatures and offer excellent underfill-to-die passivation as well as outstanding adhesion to a variety of substrates. They exhibit remarkably fast cures of 25-30 minutes at 250°F or as little as 10-15 minutes at 300°F. Their shelf life at ambient temperatures is a minimum of 3 months and a maximum of 6 months. These new underfills are 100% reactive and do not contain any volatiles.

Features of One Component Epoxy Underfill Compounds

The new Master Bond line of epoxy underfills contains low viscosity, highly flowable compounds that produce uniform void-free epoxy layers for enhancing the protection of the active die surfaces and improve stress distribution away from solder interconnects. Master Bond, furthermore, has formulated no flow fluxing underfill whose use greatly simplifies conventional flip chip assemblies, some of which can be fully cured during standard reflux cycles in-line processing. Both highly insulative and thermally conductive compounds are available. They all feature superior resistance to thermal temperature cycling as well as to mechanical shock and vibration.

  • High Reliability
  • High-Purity
  • Improved Toughness
  • Low Stress
  • Low Shrinkage
  • Excellent Adhesive Properties
  • Outstanding Electrical Insulation
  • Superior Thermal Conductivity
  • High Temperature Resistant
  • Environmentally Friendly
  • Withstands Thermal Cycling
  • Easily Dispensed

Master Bond One Component Epoxy Underfill Compounds

The following table summarizes Master Bond's range of one component epoxy underfill compounds.

Product Description
EP3RRLV One part oven cured system (125-150°C) for underfills & flip chips, good dimension stability and very easy to use. Cures rigid.
EP30AO Two part room temperature curing system with good flow, excellent dimension stability and strength properties. For underfills and flip chip. Cures rigid.
EP37-3FLF Two part room temperature curing system for flip chip applications with excellent flexibility and low viscosity.

 

Applications of One Component Epoxy Underfill Compounds

Typical applications of Master Bond's range of one component epoxy underfill compounds include:

Electronics Manufacturing

  • Semiconductor Devices
  • Passive Filters
  • Detector Arrays
  • Micro Electro-Mechanical Systems
  • Electronic Watches
  • High Speed Microprocessors
  • Computer Control Processors
  • Microprocessors
  • Digital Signal Processors
  • Smart Cards
  • Driver Chips
  • LCDs
  • Surface Acoustic Waves

Telecommunication Devices

  • Cellular Phones
  • Pagers

Automotive Electronics

Aerospace Applications

  • Spectrometers
  • Shutters/Filters
  • Bolometers
  • Propulsion and Active Mechanical/ Thermal Control Systems

Medical Devices

  • MRI Machines
  • Electro Cardiograms
  • Hearing Aids
  • X-Ray & Imaging Equipment

Electro-Optical Applications

  • Electro-Optical Sensory Devices
  • Electro-Optical Transceiver Systems

 

Reliability and Performance of One Component Epoxy Underfill Compounds

Master Bond's Flip-Chip/Underfill Systems are designed to offer superior quality and long term durability. They have earned a well deserved reputation for their performance upon exposure to hostile environmental conditions. Select from a wide range of systems conveniently packaged for ease of use. These compounds are available in different viscosities, cure times, chemical resistances, electrical properties, colors, etc. to best meet specific requirements. They are presently employed in the assembly of many critical electronic devices used in commercial, military, space and medical applications.

Electronic Grade Polymers for Electronic Manufacturing by Master Bond

Master Bond’s line of microelectronic formulations consists of epoxies, silicones, polyurethanes, acrylics and latex solutions. They include electrically insulative, thermally conductive and electrically conductive systems. Both one and two component compounds are available for use. These products are currently employed in applications ranging from heat sinking to glob tops to surface mounting. Many of these compounds have unique properties such as low thermal expansion coefficients, exceptionally high thermal conductivity, low stress, etc. Master Bond is also actively engaged in developing new products to keep pace with the rapid technological advancements in the microelectronic industry ranging from flip-chip technology to advanced die-attach processes.

Master Bond offers specialty systems for computers, telecommunications devices, audio/video devices, avionics and aerospace applications, as well as automotive manufacturing, interactive circuitry and advanced semiconductor equipment.

This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.

For more information on this source, please visit Master Bond Inc.

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