One Component UV Curable Adhesive, Sealant and Encapsulant UV24TKLO Meets NASA Low Outgassing Requirements

Single component, rapid curing Master Bond UV24TKLO requires no mixing and has high physical strength properties. It passes the rigorous requirements for low outgassing per ASTM E-595. It also features high dimensional stability, optical clarity and light transmission properties. Most noteworthy is its superior chemical resistance profile.

Master Bond UV24TKLO

Master Bond's UV24TKLO can be cured up to 1/16th of an inch and can be easily “layered” to higher levels. It has a moderate viscosity and cures in seconds in thin layers when exposed to UV light in the 320-365 nm range. Bond strength to similar and dissimilar substrates is excellent. To optimize outgassing properties UV24TKLO should be preheated to approximately 50°C for 15 minutes prior to use and then allowed to cool down to room temperature. This system is not oxygen inhibited.

UV24TKLO is ideal for potting and encapsulation. It has superb electrical insulation properties.  It has a volume resistivity of >1014 ohm cm and a dielectric constant at 60 Hz of 3.7. UV24TKLO contains no solvents on diluents. It is presently employed in many optical, electro-optical and vacuum applications that until now have not been possible for UV cure systems.

Master Bond’s line of UV curable products vary in viscosity, hardness, thermal, electrical properties, etc. They are designed to speed processing time and eliminate waste. They are environmentally safe, easy to apply in syringe applicators and are storage stable at ambient temperatures.

Proper Application of Low Outgassing Adhesives

To fully comprehend the low outgassing products one must recognize when to use them. These products are not only limited to space systems, in fact, the most common utilization of low-outgassing products are those that involve optical or electro-optical components. These components are able to be clouded or fogged by outgassed chemical compounds. The outgassing affects can be seen in some sensitive electrical processes—these affects arise by interfering with electrical continuity. Additionally, semiconductor manufacturing processes are sometimes extremely sensitive to outgassing material systems.

If one suspects a problem in the application, specifying adhesives that comply with the ASTM outgassing standard will make sense as long as one of the compliant grades meets all of your other technical requirements. The positive side is that low outgassing adhesives don’t usually need any sacrifice in other mechanical or physical properties.

This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.

For more information on this source, please visit Master Bond Inc.

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