The QUALISURF® Series of Wet Process Chemical Monitoring Systems

Existing process demands for both 3D stacking and sophisticated transistors need wet process control beyond previous equipment abilities. The number of required selective chemical deposition steps is expanded by scaling down to MOL and the multilayers of BEOL.

Fast rollout from research and development to largescale manufacturing implies that wet chemical deposition equipment should be scalable, precise and economical.

The QUALISURF® range of analyzers are completely automated online, inline and benchtop chemical monitoring systems that can be configured for sophisticated etching and cleaning applications to accurately control the composition of metallization solutions, such as contaminants and additives in the sub-ppm level.

The QUALISURF platform has a flexible architecture that helps install different methods together to methodically carry out process controls, such as:

  • Qualify incoming wet chemistry 
  • Chemical quality control for facilities and production floors
  • Advanced cleaning chemistries with multiple species
  • Multiple process tools can be supported
  • Process solutions can be tracked and optimized for reuse
  • User can reclaim or recycle chemistry for efficient process and to fulfill environmental and sustainability goals

Application Guide for QUALISURF Analyzers

Source: ECI Technology

Model

Process

Application

Benefit

QSF-100

BEOL

  • Diluted Ozone for silicon-germanium (SiGe) cleans
  • Integrated, point-of-use

QSF-200

BEOL

  • Clean & Etch PERR
  • W Contacts PERR
  • TiN Hard Mask Removal
  • AlOx/HMO Cleans
  • Continuous measurement of all critical components
  • Enables re-use of chemicals
  • Excellent performance for H2O2

QSF-200

FEOL

  • DSP+ Wall Residue Removal
  • ESL Removal
  • Mixing quality control, fab and facility

QSF-300

Materials Quality

Control/Facilities
and Waste
Management

  • DSP+ Blend
  • Metal Contaminants
  • Waste Management

 

  • Qualifying incoming chemicals, critical to managing cost, yield and reliability at advanced design nodes
  • Tight control DSP+ mix concentrations

QSF-500

FEOL

  • Selective Si Etch with hot phosphoric acid (H3PO4) Trench Isolation
  • Spacing and Thinning
  • Bit-line
  • Patented method for Si, precise/efficient Si monitor

QSF-600i

Post CMP
process

  • In-line chemical monitoring of chemical mixing and dilution systems

 

QSF-800

MOL

BEOL

  • Cobalt PERR

 

  • Control of all known components
  • Enables re-use of chemicals

QSF-900

FEOL

  • Sigma Anisotropic Etch (TMAH)
  • Si Etch
  • SiGe
  • GAA
  • Polysilicon Etch
  • Photoresist Strip, Removal and Rework
  • Multiple components are measured by NIR, <5 mins. per tank
  • Superior selectivity for Si Etch

QSF-
W100

Advanced Packaging

  • UBM Copper Etching Reclaim
  • Enables re-use of chemicals

QSF-
W200

Advanced Packaging

  • Photoresist Strip, Removal and Rework
  • Tight process control

 

Key Features

  • Enables spectroscopy integration and communication with all the process tools and the Fab host for closed-loop control
  • Uses recipe-based measurement and data analysis with both output and visualization of outcomes, with export in numerous data formats
  • Provides numerous recirculation line support for each chemistry
  • Provides comprehensive histories and current status of the tanks, and also displays SPC data without interrupting the automatic analysis sequence
  • Enables solution reclaim; leads to reduced costs because of less wastage
  • Automatic control and analysis of chemical components and species
  • A tank summary includes analysis data on each process chamber, as well as the standard data 
  • The frequency of analysis can be defined by users and is based on the analytical technique and the chemistry
  • Unique, low maintenance electrodes and several integrated automated routines, allow simple diagnostics, maintenance and troubleshooting
  • For result comparison, a separate history of SPC alarm messages and a chronological history of alarm messages are available
  • Numerous alarm indicators alert operators relating to problems in tanks or instruments

Key Benefits

Process Improvement

  • Quick characterization and analysis of process bath chemistry enable instant response and rectification to process conditions. Product yields are also increased by knowing a quantitative process composition.
  • Established reliability of 95% availability with an MTBF of more than 1000 hours*
  • A completely automated system makes use of programmable recipes for accurate control. Such recipes comprise steps for delays, sample extraction, composition replenishment and purges to clean lines, thereby offering more process knowledge and precision for tighter process control.
  • Enables solution reclaim; leads to reduced costs due to less wastage.

Versatile

  • Numerous chemistries and process tools, such as detection of variations in incoming raw chemical supply, are sampled and analyzed
  • The modular design enables flexible configuration and thus enhances the uniformity and reproducibility of the process
  • Multi-channel abilities support all the tanks for a process tool
  • Can be configured for sub-fab setting

User-Friendly

  • Flexible software offers many viewing options
  • Software makes process control easy with alarm settings, status conditions, and online help 
  • Reduced preventative maintenance requirements decrease the cost of consumables and can be readily field serviced 

*Chemistry dependent 

Technical Specifications

  • AC: 180 to 245 VAC 50/60 Hz and 15 A
  • Dimensions: 762 (30″) width x 1822 (71.75″) height x 610 (24″) depth
  • Bulk refill: Dry contact
  • Safety interlocks
  • Conforming standards: CE, NFPA 79, SEMIS2-S8 and SEMI F47
  • Data communication: Numerous communication protocols such as Serial, RS-232, TCP/IP and SECS/GEM

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