Posted in | Metrology

QUALI-FILL® LIBRA: A Chemical Management System for Advanced Packaging and Electroplating

The new QUALI-FILL® LIBRA online standalone metrology systems from ECI Technology have been specifically engineered to quantify material properties like Ni, Cu, SnAg and other crucial chemical species in plating solutions used for wafer packaging and other applications.

The QUALI-FILL® LIBRA system has a modular design and can be configured to fulfill users’ demands. Developed based on ECI’s established QUALI-FILL® chemical management platform, this sturdy system easily combines with R&D and production fabrications and is in compliance with the latest SECS/GEM and safety guidelines.

The QUALI-FILL® LIBRA K series takes metrology performance to an ultra-safe and ultra-clean wafer fabrication environment. It helps monitor plating chemicals used for wafer level packaging processes like TSV, RDL, UBM and Micro Bumping processes like fan-out, SOC, and others.

The QUALI-FILL® LIBRA A system has been developed for the tough settings of printed circuit board manufacturing. It is exclusively designed for analyzing plating chemicals in PLP and PCB manufacturing, like Electroplated Ni, Cu, Au, Pd, Sn and Sn-alloys, as well as Electroless Ni, Cu, Pd, Au and Zincate.

The smart QUALI-DOSE system combines easily with QUALI-FILL LIBRA systems to accurately dose plating baths with replenishing solutions.

Breakdown products. Source: ECI Technology

Process Solution Contaminant Analytical Technique
Cu Suppressor BP SBP, ST-based, TOC
Accelerator BP DPA, ABP, AABP, HPLC
Leveler BP DPA-C CVS
PR/contaminant Spectroscopy/Titration
Metal contaminants: Sn, Ni, Co, Au ICP
Sn and SnAg PR/contaminant (SnIV) Spectroscopy/Titration
Metal contaminants: ICP Cu, Ni, Co, Au ICP
Ni, Co PR/contaminant Spectroscopy
Metal contaminants: Cu, Sn, Au UV-Vis for Cu, ICP for Sn and Au
Leveler BP in Atotech chemistry UV-Vis
Au Metal contaminants: Cu, Ni, Co, Sn UV-Vis for Cu, ICP for Sn and Au


Main Features

  • Versatile, modular design supports various types of manufacturing lines
  • Includes several analytical techniques to find and quantify the concentrations of crucial chemical species
  • Parallel close-loop integration to several plating process tools
  • Parallel analysis of various chemistries
  • Users can communicate with fabrications CIM via SECS/GEM
  • Multiple tanks can be supported for each chemistry

Main Benefits

  • The main advantages of the QUALI-FILL LIBRA analyzers are their patented and proprietary methods to detect and quantify contaminants like photoresist, additive by-products and trace foreign metals. Such contaminants have an impact on the plating results and are crucial to managing the quality of the plated products.
  • The system monitors and allows process understanding of control process solutions and waste streams for treatment or recycling
  • Intelligent dosing capabilities help tighten the process
  • Unprecedented repeatability and accuracy can be ensured by using minimal, cost effective reagent solutions. High value analyses can be performed with low consumables and low cost per analysis.
  • ECI offers fast development times for brand new chemistries
  • Flexible configurations with an extensive range of applications

Technical Specifications

  • Conforming standards: CE, NFPA-79, SEMI F47, SEMI S2-S8, KRWA
  • Dimensions:
    • 1 cabinet: 762 mm (30″) W x 2064 mm (81.2″) H x 610 mm (24″) D
    • 2 cabinets: 1524 mm (60″) W x 2064 mm (81.2″) H x 610 mm (24″) D
    • 3 cabinets: 2286 mm (90″) W x 2064 mm (81.2″) H x 610 mm (24″) D
  • AC: 180 to 245 VAC, 50/60 Hz, 15 A
  • Data communication: Multiple communication protocols— TCP/IP, Serial, SECS/GEM, RS-232

QUALI-FILL® LIBRA: A Chemical Management System for Advanced Packaging and Electroplating

Image Credit: ECI Technology


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