Fast Cure Temporary Adhesive for Electronic Applications

Master Bond's UV14-3 is a temporary bonding adhesive that has a fast UV cure ideal for automated, non- permanent adhesive assemblies. Environmentally safe, the temporary adhesive can be easily removed without surface contamination. It cures within seconds upon exposure to UV light at room temperatures and produces high strength bonds to a variety of substrates.

The removable adhesive's high flexibility imparts excellent vibration and shock resistance as well as resistance to thermal cycling and thermal shock. Master UV14-3 can be cured in much greater section thickness (up to 1/8 inch deep) compared to most conventional UV type systems, making it of value for various electronic and opto-electronic potting and encapsulation applications. Disassembly can be easily accomplished upon exposure to most conventional solvents such as acetone, MEK, etc.

Master Bond UV14-3, UV cure adhesive, is durable and tough. The re- workable adhesive has a Shore D hardness of 30 and an elongation of 150%. Featuring a volume resistivity of 1014 ohm-cm, UV14-3 is a superb electrical insulating compound. Having a low viscosity of 800 cps makes it easy to apply. Non-yellowing properties combined with a refractive index of 1.47 qualify it for use in optical applications. It has a service operating temperature range of -60°F to +250°F. Storage stability is 6 months at room temperatures in unopened containers.

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Master Bond Inc.. (2019, February 10). Fast Cure Temporary Adhesive for Electronic Applications. AZoM. Retrieved on March 26, 2023 from https://www.azom.com/news.aspx?newsID=20214.

  • MLA

    Master Bond Inc.. "Fast Cure Temporary Adhesive for Electronic Applications". AZoM. 26 March 2023. <https://www.azom.com/news.aspx?newsID=20214>.

  • Chicago

    Master Bond Inc.. "Fast Cure Temporary Adhesive for Electronic Applications". AZoM. https://www.azom.com/news.aspx?newsID=20214. (accessed March 26, 2023).

  • Harvard

    Master Bond Inc.. 2019. Fast Cure Temporary Adhesive for Electronic Applications. AZoM, viewed 26 March 2023, https://www.azom.com/news.aspx?newsID=20214.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit