Two Part Epoxy Suited to Potting, Coating and Sealing Electronic Assemblies

Master Bond EP21FL is a two part epoxy resin system that features low to moderate viscosity. It is well suited for potting, coating and sealing electronic assemblies and excels at bonding dissimilar substrates with different coefficients of expansion. This high performance adhesive has a wide service temperature range of -60ºF to +250ºF.

The typical viscosity of Part A is 4,000 cps at 25ºC and 10,000 cps at 25ºC for Part B. This system produces high strength castings, bonds and seals which are remarkably resistant to thermal cycling and shock. Its bond strength is generally greater than 1,500 psi and its tensile strength normally exceeds 1,100 psi.

The hardened compound is an electrical insulator with a volume resistivity greater than 1012 ohm-cm. As a flexibilized system, it is characterized by superior impact and chemical resistance.

EP21FL is available in half pint, pint, quart, one gallon and five gallon container kits.

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