Electrically Insulative, Thermally Conductive Master Bond EP3RR-80 for Bonding, Sealing, Potting and Encapsulation Applications

Developed for a variety of bonding, sealing, potting and encapsulation applications, Master Bond EP3RR-80 is a one component epoxy that offers user friendly handling. It has a moderate viscosity, good flow properties and an unlimited working life at ambient temperatures. Additionally, this system can be stored at 40-50°F and does not require freezing.

Master Bond EP3RR-80

Unlike typical one part epoxies, EP3RR-80 will cure in 45-50 minutes at 80°C (175°F), or in 25-30 minutes at 250°F. It features low exotherm while curing enabling it to cure in thicker sections up to and beyond a 1/2 inch deep. This dimensionally stable compound forms high strength bonds to metals, composites, ceramics, glass and many plastics.

EP3RR-80 has superb electrical insulation characteristics and delivers a thermal conductivity of 5-6 BTU.in/(ft².hr.°F) [0.72-0.87 W/(m.K)] at 75°F. Resistance to water, oils, fuels and many other chemicals is outstanding. Service operating temperature range is -100°F to +350°F.

This compound is widely employed in the electronic, aerospace, specialty OEM and related industries. It is available for use in syringes as well as standard containers ranging from ½ pints to gallons.

Master Bond Flip Chip Adhesives
Well suited for flip chip underfill applications, Master Bond EP3RR-80 is a single component compound that cures rapidly at elevated temperatures. It offers thermally conductivity, electrical insulation and dimensional stability. Read more about Master Bond’s flip chip adhesives at http://www.masterbond.com/industries/underfill-encapsulants or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: [email protected].

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