High Temperature Resistant, One Component Epoxy Cures at 200-220°F

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F (93-105 °C).

Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates in the aerospace, electronic, optical and other high-tech industries.

This moderate viscosity compound has good flow properties and can be cast in sections up to ½ inch thick. EP17HT-100 is not premixed and frozen and has an unlimited working life at room temperature. It is a reliable electrical insulator offering a volume resistivity of >1015 Ω·cm.

This dimensionally stable system bonds well to metals, composites, ceramics, glass and many plastics. EP17HT-100 exhibits a tensile lap shear strength exceeding 2,700 psi at ambient temperatures after being post cured for several hours at 350-400°F.

EP17HT-100 has superior chemical resistance to oils, fuels, acids, bases, water and many solvents. It has a thermal conductivity of 4-5 BTU·in/(hr·ft²·°F) [0.58-0.72 W/(m·K)]. The service temperature range for this product is -100°F to +500°F. EP17HT-100 is naturally yellow-tan, but other colors are also offered. It is available for use in syringes, ½ pint, pint, quart and gallon containers.

Master Bond High Strength Adhesives

Master Bond EP17HT-100 is an easy to handle, one part encapsulation, bonding and sealing compound capable of curing at lower temperatures. It features excellent thermal, electrical and physical strength properties. Read more at http://www.masterbond.com/properties/strength-properties-epoxy-compounds


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