With the ZEISS Crossbeam-FIB-SEM, users can integrate the imaging and analyzing capabilities of a high-resolution field emission scanning electron microscope (FE-SEM) with the processing capabilities of a next-generation focused ion beam microscope (FIB). Users may be operating in a multi-user facility, an academic or industrial lab.
The users can benefit from ZEISS Crossbeam’s modular platform concept to expand the system as customer demands increase, such as with the LaserFIB for huge material ablation. Crossbeam will accelerate the FIB applications during milling, imaging and 3D analytics.
- Maximize SEM Insights
- Increase FIB Sample Throughput
- Experience Best 3D Resolution in FIB-SEM Analysis
Highlights
Maximize SEM Insights
- Using Gemini electron optics, get real sample information from the high-resolution SEM photos
- Using a variety of detectors, thoroughly characterize the sample. With the Inlens EsB detector, users can get clean materials contrast
- Examine non-conductive specimens that have not been harmed by charging artifacts
- For 2D surface, sensitive pictures or during 3D tomography, rely on the SEM capabilities of the ZEISS Crossbeam
- Tandem decel, a feature of the new ZEISS Gemini electron optics, can provide up to 30% higher SEM resolution at low voltage
- Even when employing very low acceleration voltages, benefit from great resolution, contrast and signal-to-noise ratios
Image Credit: Carl Zeiss Microscopy GmbH
Increase FIB Sample Throughput
- The Ion-sculptor FIB column presents a unique approach to FIB processing: By avoiding sample damage, users may improve sample quality while still completing experiments quicker
- When preparing TEM samples, make use of the Ion-sculptor FIB’s low voltage capabilities to get ultra-thin samples with minimal amorphization damage
- Use up to 100 nA current to manipulate the samples accurately and quickly without sacrificing FIB resolution
- Take advantage of the speed and accuracy of smart FIB scanning techniques for material removal to speed up the investigations by up to 40%
Image Credit: Carl Zeiss Microscopy GmbH
Experience Best 3D Resolution in FIB-SEM Analysis
- Collect the serial section images during milling to save time. For active picture quality control, use trackable voxel sizes and automated algorithms to achieve precision and consistency
- ZEISS Atlas 5, the market-leading package for quick, accurate tomography, may be added to the Crossbeam to increase its capacity
- ZEISS Atlas 5’s integrated 3D Analytics tool allows users to do EDS and EBSD analyses during tomography runs
- In FIB-SEM tomography, the best 3D resolution and leading isotropic voxel size provide unique insights. The Inlens EsB detector can probe to a depth of less than 3 nm and provide surface sensitive, material contrast pictures
- For EDS and EBSD examinations, make use of the advantages of integrated 3D analysis
- Crossbeam will accelerate FIB applications during milling, imaging and 3D analytics
Image Credit: Carl Zeiss Microscopy GmbH