Electrically Conductive Adhesives - One and Two Component Adhesives by Master Bond Offer Low Volume Resistivity

Master Bond’s line of electrically conductive adhesives is the number one choice for the design of tomorrow’s advanced electrical circuitry. Nobody offers more choices or solutions. The Master Bond product line includes silver, nickel, copper and graphite filled compounds. Master Bond even offer silver coated nickel systems for low resistance where cost effectiveness is crucial. Specific compounds are designed to cure at ambient temperatures or upon brief exposure to elevated temperatures. The cured products offer high physical strength, superior substrate adhesion and uniform electrical conductivity even upon exposure to hostile environmental conditions. Long term durability is excellent.

Electrically Conductive Epoxy and Elastomeric Adhesives

Master Bond’s range of electrically conductive products consist of epoxies and elastomeric systems. They are conveniently packaged for ease of use. They are available in syringes, jars, bubble packs, cartridges, etc. Two component systems can be purchased in premixed, frozen syringes. Freshly prepared to maximize shelf life, Master Bond electrically conductive compounds can be bought in quantities from grams to gallons.

The superior performance profile of our electrically conductive compounds is widely recognized throughout the electronics industry. Special grades are vibration and shock resistant, cryogenically serviceable, “snap curing”, offer exceptional peel and shear strength and are screen printable. Additionally, NASA low outgassing approved adhesives and a USP Class VI approved system for medical applications is also available.

Master Bond One and Two Component Adhesive Products

The following table summarizes Master Bond's range of one and two component adhesive products.

Product

Description

EP21TDC/S

Silver-filled, electrically conductive epoxy with low volume resistivity. Cryogenically serviceable. Good thermal cycling characteristics. Easy to process with a convenient 1:1 mix ratio. Superior physical strength properties.

EP21TDC/SFL

Highly flexibilized version of EP21TDC/S silver-filled conductive epoxy. Superb for bonding & sealing dissimilar substrates. Enhanced thermal cycling properties. High peel and shear strength.

EP79

Cost effective alternative to silver-filled epoxy with a silver-coated nickel filler. Excellent conductivity and physical properties.

SUPREME 10HT/S

Superb, silver-filled epoxy adhesive/sealant. One part, no mix system. Heat cures at 250-300°F. Cryogenically serviceable & high temperature resistant. Meets NASA low outgassing specifications.

EP76M

Nickel-filled epoxy system. Widely used for EMI/RFI shielding applications. Easily processable with a 1:1 mix ratio. Cures at ambient temperatures. High bond strength.

EP75-1

Graphite-filled epoxy adhesive/sealant for use in specialty applications as well as EMI/RFI shielding where a non-metallic filler is required. Superb resistance to moisture and chemicals. Exceptional durability.

Typical Applications for Master Bond One And Two Component Adhesive Products

Typical applications of Master Bond's range of one and two component adhesive products include:

  • Assembly and repair of electrical modules
  • Assembly and repair of PCBs
  • Assembly and repair of high frequency shields
  • Assembly and repair of wave guides
  • Assembly and repair of flat cable
  • EMI/RFI shielding
  • Entertainment systems
  • Formation of specialty heat sinks
  • Solder replacement
  • Repair of interconnections
  • Radar DSPs (digital signal processors)
  • Sonar DSPs (digital signal processors)
  • Bonding metal leadframes
  • Solar cell manufacturing
  • Electrical ground plane interface
  • High-power electronics modules
  • RFID tagging
  • PWB (printed wiring board) applications
  • LED packages-attaching LEDs to the die
  • Wireless headsets
  • Wafer lamination
  • Stack bonding
  • Copper/polymide (PI) circuits
  • Multilayer hybrid integrated circuits
  • Low temperature flip chip packaging
  • Cabinet card shielding
  • Specialty thermistors
  • Microprocessors
  • Stress control devices
  • Wire tacking
  • SMD Attachment
  • Hermetic lid-seal processes
  • Communication systems
  • Electronic test equipment
  • Microwave shielding
  • Heat dissipation applications
  • RF power applications
  • Plastic IC packaging
  • Hybrid microelectronic packaging
  • Roadside assistance systems
  • Membrane Switches
  • Microwave applications
  • Electronic assembly in pumps
  • Smartcard IC assembly
  • Antenna systems
  • Bonding polyimide flex circuits to printed circuit boards
  • Used to make electrical connections where hot soldering is impractical ("cold solder")
  • Used for making connections to PZT electrodes (lead zirconate titanate) in ultrasound applications
  • Electrical and mechanical bonding of semiconductor, capacitor, and resistor chips/networks in micro and opto-electronic hybrid circuit fabrication
  • Environmental SEMs [scanning electron microscopes (used in forensic analysis, for example)]
  • EMP (electro magnetic pulse) protection-coating system engineered to interact, through absorption or reflection, with specific regions of the electromagnetic energy spectrum resulting in EMP protection-used in the military and in other industries
  • Electrical contact systems used in relays, switches, keys, plug connectors, small DC motors, potentiometer, signal transfer, measuring
  • Adhering to metals such as Au, Cu, OSP/Cu (organic solderable preservatives), Ag, and Ag-Pd
  • Opto-electronic packaging material: LED, LCDs, and fiber optic components
  • Die attach applications [such as in MID components (mobile internet device)]
  • Used in place of Sn/Pb (tin/lead) solder balls in BGA, PPGA, and microBGA packaging, controls, & position sensors
  • Wafer carriers for stacking wafers for use during transport/storage
  • RF/Microwave device packaging found in commercial, aerospace and cockpit, and industrial (down-hole petrochemical) circuits
  • Heat sensitive substrates (such as polyester film and cell phone keypads and displays)
  • Protect from corrosion, when other methods are impractical

High Performance One and Two Component Adhesives

Master Bond’s range of electrically conductive products are designed to offer superior quality and long term durability. They have earned a well deserved reputation for their performance upon exposure to hostile environmental conditions. Select from a wide range of systems conveniently packaged for ease of use. These compounds are available in different viscosities, cure times, chemical resistances, electrical properties, colors, etc. to best meet specific requirements. They are presently employed in applications ranging from design and production to repair, maintenance and field service.

Important Electrically Conductive System Performance Requirements

Master Bond's electrically conductive adhesive systems are designed to meet specific performance requirements. Among the most important are:

  • Chemically Resistant
  • Cryogenically Serviceable
  • Excellent Adhesion
  • Dimensional Stability
  • High Temperature Resistance
  • Low Thermal Expansion Coefficient
  • Reworkable
  • Screen Printable
  • Hardness
  • Low Outgassing
  • Low Shrinkage
  • Low Stress
  • Resistance to Water
  • Peel Strength
  • Durability
  • Thermal Cycling
  • Shock Resistance
  • Impact Resistance
  • Electrical Conductivity
  • Thermal Conductivity
  • Vibration Resistance
  • Volume Resistivity
  • Glass Transition Temperature
  • Compressive Strength
  • Tensile Strength
  • Elongation
  • Flexural Strength

Customized Packaging to Customer Specifications

Master Bond offer a wide array of packaging options to speed productivity, minimize waste and save energy including:

  • Quantities from grams to gallons
  • Cans, bottles and jars
  • Cartridges for manual and pneumatic guns
  • Premixed and frozen syringes
  • Bipaks for field service kit

New Electrically Conductive Epoxy Adhesive Systems

Master Bond Inc. has recently introduced several unique electrically conductive adhesives. These include:

Product Description
EP21TDCS-LO NASA low outgassing approved, two component epoxy adhesive. Has exceptionally low volume resistivity. High peel strength and superior toughness. Cures at room temperature.
EP3HTSMed Silver-filled, electrically conductive one component epoxy adhesive. USP Class VI approved. High strength bonds. Rapid cure speed at elevated temperatures.

This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.

For more information on this source, please visit Master Bond Inc.

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