Adhesives, Sealants, Coatings and Potting and Encapsulation Compounds for the Electronics Industry

Master Bond Inc. manufactures an extensive line of adhesives, sealants, conformal coatings, potting & encapsulation compounds and other specialty systems designed to meet the diverse needs of the electronics industry. Master Bond offers specialty systems for computers, telecommunications devices, audio/video devices, avionics and aerospace applications, as well as automotive manufacturing, interactive circuitry and advanced semiconductor equipment. Our line of electronic formulations consists of epoxies, silicones, polyurethanes, acrylics and latex options.

Specific Master Bond grades offer:

  • High bond strength to similar and dissimilar substrates
  • Thermal and electrical conductivity
  • Slectrical insulation properties
  • Low stress
  • Low outgassing
  • Dimensional stability
  • Low coefficients of thermal expansion
  • High and low temperature serviceability
  • Resistance to water and a wide range of chemicals
  • Fast cures at ambient temperatures or slightly elevated temperatures
  • Withstand exposure to vibration, impact and shock
  • Exceptional durability
  • Easily repairable

Master Bond provides prompt personalized "one-on-one" technical assistance and will be glad to answer any questions you may have. We have over three decades of experience in solving technical problems.

Adhesives, Sealants, Coatings and Potting, Encapsulation Compounds, epoxies

Most Popular Products

Master Bond's most popular products are given in the table below.

    Product   Description
Silver Conductive EP21TDC/S Two part, room temperature curing, silver conductive epoxy with a service temperature range of 4K to 275°F. Excellent mechanical properties and high sheer and peel strength. One to one mix ratio and low volume resistivity <10-3 ohm-cm.
Underfill Potting EP3RR-1 This potting and underfill one part heat cured epoxy features a fast cure, as well as good heat resistance. Additionally, this product is thermally conductive, castable to 1 inch thick, and serviceable from -60º to 400ºF.
Thermal Conductive EP30AN-1 Two part, room temperature curing epoxy with good electrical insulation properties. Used primarily in potting and bonding. Low viscosity and good flow properties. Meets NASA low outgassing specifications and exhibits exceptional thermal conduction properties
Chemical Resistant EP41S-1 Two part, room temperature curing epoxy widely used as a bonding, coating, and potting epoxy where excellent solvent resistance is needed. Exhibits good flow properties and excellent bonding characteristics.
Low Outgassing SUPREME 10HT/S One part, heat cured system (125-150°C) with excellent electrical conductivity and physical properties. Widely used for die attach and chip bonding. Outstanding bonding and thermal cycling capabilities.
Silicone MASTERSIL 713 One part, room temperature curing RTV. Rapid setting with excellent flexibility, very low viscosity, and outstanding temperature resistance. Additionally, exhibits resistance to moisture, and is often used as a compound coating with remarkable repairability.
Shielding AC85 Acrylic based, silver conductive, one part system for EMI/RFI shielding. Surface resistivity <0.01-0.03 (ohm²).


Potting and Encapsulation Materials

Master Bond Inc. offers a broad line of potting and encapsulation materials designed to protect electronic circuitry and assemblies from potentially damaging conditions such as moisture, various corrosive chemicals, excessive heat, vibration, mechanical impact, thermal shocks and abrasion which might occur while the device is in operation. While the majority of the products offered are epoxies, including both rigid and flexible types, other systems are also available such as polyurethanes and silicone compounds. These systems include two part systems that cure at ambient temperatures or more quickly at elevated temperatures, as well as one part, no mix systems requiring elevated temperature cures. Master Bond's potting and encapsulation epoxies feature outstanding electrical insulation characteristics including high volume resistivity, excellent dielectric strength and low dielectric constants and dissipation factors. Some of the more specialized compounds include epoxies that are flame resistant, thermally conductive and cryogenically serviceable. Master Bond's technical staff will be glad to recommend the product best suited to your particular application's requirements.

Adhesives, Sealants, Coatings and Potting, Encapsulation Compounds, epoxies

Thermally Conductive Products

The recent trend in electronic packaging is for greater functionality in decreasing sizes of circuitry. This phenomenon has caused an urgent need for enhanced heat dissipation and heat sinking without loss of desirable electrical insulation characteristics. Master Bond Inc. offers a wide range of thermally conductive, electrically insulative systems which offer effective solutions to demanding heat dissipation problems. Master Bond manufactures both one and two component thermally conductive systems including epoxies, silicones and other elastomeric systems. Some of the more special systems are serviceable at very high temperatures (500F) or at cryogenic temperatures (4K). Also noteworthy are our NASA approved thermally conductive systems for high vacuum applications. A new Master Bond innovation is our thermally conductive film system, FL901AO, which can be used as an adhesive, sealant and coating. Films are available in a variety of shapes and sizes and offer ease of assembly with minimal waste.


Adhesives, Sealants, Coatings and Potting, Encapsulation Compounds, epoxies

Conformal Coatings

Conformal coatings are essential materials for enhancing the long-term reliability and performance of electronic assemblies, particularly when exposed to harsh conditions such as high humidity, corrosive chemicals and extreme temperatures. Master Bond Inc. offers a complete line of conformal coatings that are easy to apply and provide superior protection for printed circuitry. These conformal coatings include very fast, one part, UV curing formulations, one and two part epoxies, one and two part silicones and a unique, cost-effective latex system. These coatings can be applied by spraying, dipping, flow coating and other conventional processing techniques. Master Bond Inc. will be glad to recommend specific products for your particular application.

Adhesives, Sealants, Coatings and Potting, Encapsulation Compounds, epoxies

Electrically Conductive Products

Master Bond Inc. offers a broad line of electrically conductive adhesives, sealants and coatings which are widely used in the electronic and electrical industries. They are formulated with metal powders and flakes such as silver, nickel, copper and silver-coated nickel, with silver formulations exhibiting the highest levels of electrical conductivity. Graphite-filled formulations have also been developed for use where metal additives are not desirable. Master Bond offers a number of room temperature curing and low elevated temperature curing, electrically conductive systems for applications where heat-sensitive components must be bonded to circuit boards and other assemblies or for repair of circuitry. Other applications range from the construction of disc drives to die attach and flip-chip processes. Also available are electrically conductive coatings which are widely employed for EMI/RFI shielding of plastic molded parts to prevent undesirable electrical interference. There is also an increasing demand for electrically conductive sealants. Master Bond offers both two and one part conductive sealants. The two part systems are primarily epoxies. The one part types are heat-cured epoxies and room temperature curing acrylics and elastomers. The newest innovation is our multi-functional, electrically conductive film, FL901S, which can be used as adhesive, sealant or coating. This silver film is available in a variety of shapes and sizes and offers ease of assembly with minimal waste.

Adhesives, Sealants, Coatings and Potting, Encapsulation Compounds, epoxies

Master Bond Products are Used in a Wide Range of Electronics

Master Bond products are used in a wide range of electronics including:


  • Die attach adhesive for chip stacking BGA, high thermal BGA, LED, and smart card application
  • EMI Shielding and gasketing
  • Bonding of Capacitors
  • Electro plating
  • Transducer mounting
  • Stress relief bridge bonds
  • Backfilling connectors
  • Speaker Repair
  • Tamperproofing
  • Potting of high voltage transformers and sensors
  • Potting LED arrays
  • Sensor device/OEM Implantation
  • Adhesion to GaAs devices
  • SMD Bonding
  • Wire tacking
  • LCD/LED adhesive for laminating glass layers
  • As a dielectric layer in the fabrication of capacitors
  • Laminating PZT ferroelectrics
  • Motors
  • Inductor coils
  • Bonding ferrite cores and magnets
  • For use as board level cornerbond for IC packages, such as CSPs and BGAs
  • Printed circuit board
  • Circuit board manufacturing
  • Satellite transmission
  • Staking electrical components to chassis or circuit boards
  • Surface mount
  • RFID and smart card assembly
  • To repair mechanical or thermal damage to PC board base material
  • Lifted conductor repair
  • Securing electrical connectors
  • Piezoelectric devices
  • Coating of thermistors
  • Manufacturing of LCD, Plasma, CRT, and PTV cabinets
  • Cellular phones
  • Printers
  • Cameras
  • Creation of optical circuits in wave guides
  • For application in telecommunication devices
  • Bonding of components within the hard drive
  • Fixing of voice coil to armatures
  • Adhesion of bonded magnet to rotor yoke in a spindle motor
  • Bearing cartridge assembly
  • Sealing of electrical modules

Packaged the Way You Need It

We offer a wide array of packaging options to speed productivity, minimize waste and save energy including:

  • Quantities from grams to gallons
  • Cans, bottles and jars
  • Cartridges for manual and pneumatic guns
  • Premixed and frozen syringes
  • Bipaks for field service kits

Adhesives, Sealants, Coatings and Potting, Encapsulation Compounds, epoxies

This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.

For more information on this source, please visit Master Bond Inc.


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