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Boeing Presents Performance Excellence Award to Hexcel

HEXCEL today announced that it has received a 2012 Boeing Performance Excellence Award.

From Hexcel 23 Jan 2013

Molded Fiber Glass Construction Products Begins New Round Column Form Production

Molded Fiber Glass Construction Products (MFG CP), has begun production on a new round column form.

23 Jan 2013

SK Continental to Develop and Distribute Lithium-Ion Based Battery Systems

At the beginning of this year, SK Continental E-motion closed the transaction and officially started operations following the approval of the relevant authorities.

23 Jan 2013

Imec, Cadence Demonstrate 3D Memory-on-Logic DFT Solution at European 3D TSV Summit

At the European 3D TSV Summit in Grenoble, France on January 22-23, 2013, imec, a world-leading nano-electronics research institute, today announced that together with Cadence Design Systems they have developed, implemented and validated an automated 3D Design-for-Test (DFT) solution to test logic-memory interconnects in DRAM-on-logic stacks. The solution, based on Cadence® Encounter® Test technology, was verified on an industrial test chip containing a logic die and a JEDEC-compliant Wide-I/O Mobile DRAM.

From IMEC 22 Jan 2013

Lattice Semiconductor Announces Array of Advancements to FPGA Design Software Platforms

Lattice Semiconductor Corporation today announced an array of advancements to its software platforms, debuting new versions of Lattice Diamond® and iCEcube2™ design tools. The updated software prominently features several notable advancements that improve power calculations and design productivity aimed at the creation of mobile and consumer, communication, and industrial systems that undergo fast design cycles, demand power efficiency, and have aggressive cost constraints.

22 Jan 2013

Cebu Pacific Air Buys A320 with Fuel-Saving Wing Tip Device

Cebu Pacific Air took delivery of its first A320 equipped with Sharklets today during a ceremony in Manila, becoming the first operator of the new fuel-saving wing tip devices in the Philippines.

22 Jan 2013

Dow Corning, Crystal Solar Plan to Develop Business Relationship

Dow Corning, a global leader in silicones, silicon-based technology and innovation, and Crystal Solar, a solar energy venture company focusing on Direct Gas to Wafer™ technology, today announced their intention to develop a business relationship for the successful supply of high-performance, silicon-based materials for photovoltaic (PV) cells and modules.

From Dow Corning 22 Jan 2013

Thomson Reuters Names Texas Instruments as a Top 100 Global Innovator

Texas Instruments Incorporated (TI) today announced the company has been named a Thomson Reuters 2012 Top 100 Global Innovator. The program, an initiative of the IP Solutions business of Thomson Reuters, honors corporations and institutions around the world that are at the heart of innovation.

22 Jan 2013

Capital & Expenses Report on US Semiconductor & Electronic Components Manufacturing Industry

Research and Markets has announced the addition of the "2013 U.S. Semi-Conductor & Electronic Components Mfg. Industry-Capital & Expenses Report" report to their offering.

From Research and Markets 22 Jan 2013

New Series of MICROTAN Solid Tantalum Chip Capacitors from Vishay Intertechnology

Vishay Intertechnology, Inc. today introduced a new series of molded MICROTAN® solid tantalum chip capacitors for space-constrained consumer electronics. TL8 series devices employ a high-volumetrically efficient packaging solution to enable the industry's highest capacitance-voltage ratings in small case sizes down to 0805 with low profiles from 0.8 mm to 1.0 mm.

22 Jan 2013

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