What does it take to make it to 80 years in an industry where today’s technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.
Leading semiconductor test equipment supplier Advantest Corporation has extended its V93000 capabilities with the introduction of its new DPS128HV module, a high-density device power supply (DPS) unit designed to handle a wide range of operating voltages for testing devices such as eFlash memory ICs.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing. This breakthrough approach, known as FlexLine™, delivers an unmatched level of flexibility and cost savings for wafer level packaging (WLP).
Dr. Ali Shakouri, Microsanj Co-founder and Chairman of the Advisory Board, has been selected to be the SEMI-THERM 2014 recipient of the THERMI award in recognition of his contributions to the field of semiconductor device and systems thermal issues.
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced that it has received a multiple system order for the Company's new Purion XE™ single wafer, high energy implanter.
Camtek Ltd., today announced that it is starting the customer evaluation of its next generation Semiconductor Inspection and Metrology platform. This a major milestone event, rejuvenating Camtek's semiconductor product line with the latest cutting-edge inspection technologies, designed for the Advanced Packaging market.
Research and Markets has announced the addition of the "Global Sapphire Market In Semiconductors by Growth Technologies, Substrate Wafer, Devices, Applications, and Geography- Analysis & Forecast (2013-2020)" report to their offering.
Aehr Test Systems, a leading supplier of semiconductor test and burn-in equipment, today announced it has received over $1.5 million in follow-on orders for WaferPak full-wafer contactors for its FOX-1 and FOX-15 wafer-level burn-in and test systems.
Cree, Inc. introduces the new CPW5 Z-Rec® high-power silicon-carbide (SiC) Schottky diodes, the industry’s first commercially available family of 50 Amp SiC rectifiers. Designed to deliver the cost reduction, high efficiency, system simplicity and improved reliability of SiC technology to high power systems from 50kW to over 1MW, these new diodes can address demanding applications that include solar / PV inverters, industrial power supplies, induction heating, battery charging stations, wind turbine converters and traction inverters.
Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, today announced the purchase of the full product portfolio and intellectual property of California-based Touchstone Semiconductor Inc., an early-stage power management technology company and provider of high-performance, low-power analog IC products. Silicon Labs purchased the assets of Touchstone for $1.5 million.
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