Leading semiconductor test equipment supplier Advantest Corporation has launched its newest test handler for system-on-chip (SoC) devices, the field-upgradable M4871 pick-and-place system.
Rudolph Technologies, Inc. announced today that it has won orders for its AWX™ FSI unpatterned wafer inspection system at both a major Southeast Asia-based outsourced assembly and test (OSAT) facility and a key Korean memory manufacturer.
NXP Semiconductors N.V., the global leader in secure banking and eGovernment deployments, today launched its new SmartMX2-P40 platform of chip card microcontrollers for large-scale projects in the rapidly growing banking and electronic-Government (eGov) markets.
Further easing the development of processing-intensive applications, Texas Instruments (TI) is unveiling a new system-on-chip (SoC), the 66AK2H14, and evaluation module (EVM) for its KeyStoneTM-based 66AK2Hx family of SoCs. With the new 66AK2H14 device, developers designing high-performance compute systems now have access to a 10Gbps Ethernet switch-on-chip.
Toshiba Corporation Semiconductor & Storage Products Company today announced that it will showcase its leading-edge semiconductor solutions at China Hi-Tech Fair ELEXCON 2013. Toshiba will highlight solutions in five areas: "Mobile", "Home Appliance", "Industrial", "Automotive" and "Memory & Storage", under the unifying concept “A Smart Future Starts from Toshiba Semiconductor Solutions.”
Multi-project prototyping service offers large cost savings as manufacturing costs are shared between multiple users
TowerJazz, the global specialty foundry leader, today announced it will participate at the Electronic Design and Solution (EDS) Fair in Yokohoma, Japan on November 20-22, 2013 to further its relationships with its EDA partners in Japan and gain more exposure with Japanese fabless companies and IDMs for the local availability of its pure play foundry offerings and design enablement innovation. TowerJazz has participated at EDSFair for the past two years since its acquisition of the Micron fab in Nishiwaki, Japan.
Leading semiconductor test equipment supplier Advantest Corporation's U.S. subsidiary Advantest America, Inc. has earned a spot on the U.S. Environmental Protection Agency's (EPA) Top 30 Tech and Telecom list. This is the first time that Advantest America has been ranked on EPA's quarterly list, which represents the 30 largest green power users among technology and telecommunications companies within the Green Power Partnership.
Although silicon semiconductors are nearly universal in modern electronics, devices made from silicon have limitations—including that they cease to function properly at very high temperatures. One promising alternative are semiconductors made from combinations of aluminum, gallium, and indium with nitrogen to form aluminum nitride (AlN), gallium nitride (GaN), and indium nitride (InN), which are stronger and more stable than their silicon counterparts, function at high temperatures, are piezoelectric (that is, generate voltage under mechanical force), and are transparent to, and can emit, visible light.
The Silicon Integration Initiative (Si2) announced today their OpenPDK Coalition has released the Open Process Specification v1.1. The Open Process Specification (OPS), from Si2’s OpenPDK Coalition, contains all of the data elements that are necessary to automatically create a Process Design Kit (PDK) in any EDA vendor’s or company proprietary design flow.
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