Reportlinker.com announces that a new market research report is available in its catalogue: Global Semiconductor Wafer Cleaning Systems Market 2012-2016
In a paper appearing in Nature's Scientific Reports, Dr. Ramesh Mani, professor of physics and astronomy at Georgia State University, reports that a giant magnetoresistance effect depends on the physical size of the device in the GaAs/AlGaAs semiconductor system.
Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced availability of its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free solder bump plating applications. This next-generation formulation features enhanced plating performance, bath stability and ease-of-use, thereby enabling the industry's widest process window with the most robust process flexibility and a competitive cost of ownership (COO).
ZMD AG (ZMDI), a Dresden-based semiconductor company that specializes in enabling energy-efficient solutions, today announces that it is the proud recipient of the regional "Best Company for Innovation and Sustainability Award" from the International Alternative Investment Review (IAIR) magazine.
Today, ASML and imec announced the next major step in their extensive collaboration, with the launch of the Advanced Patterning Center. Together they plan to tackle upcoming scaling challenges due to the chip industry’s move towards single digit nanometer dimensions. The Center will be located at the imec campus in Leuven and is expected to grow to close to 100 engineers over the next couple of years.
Linde North America praised President Obama for signing legislation into law reauthorizing the Federal government's helium program, which is the source of 40% of the nation's helium. The legislation was passed last week by a bipartisan vote of the U.S Senate and House of Representatives.
ZMD AG (ZMDI), a Dresden-based semiconductor company that specializes in enabling energy-efficient solutions, today announces the product release of an energy-efficient DC/DC regulator for non-isolated step-down applications.
Oerlikon Advanced Technologies, a leading supplier of PVD deposition equipment, has today set a new standard with the CLUSTERLINE® 300 as the first 300mm system worldwide running thin wafer backside metallization (BSM) for power devices in production.
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it has received an order for the Company's innovative, new Purion MTM medium current implanter.
Cascade Microtech, Inc., a leader at enabling precision measurements of integrated circuits at the wafer level, has acquired ATT Advanced Temperature Test Systems GmbH ("ATT Systems"), which is headquartered in Munich Germany. ATT Systems is a leader in the manufacturing of advanced thermal systems used in the testing of semiconductor wafers.
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